Filler-containing film

Abstract

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

1 . A filler-containing film comprising a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein
 an area occupancy rate of the fillers in a plan view is 25% or less,   a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and   a proportion of the fillers present in a non-contact state with each other is 95% or more with respect to the entire population of fillers.   
     
     
         2 . The filler-containing film according to  claim 1 , wherein the proportion of the fillers present in a non-contact state with each other is 99.5% or more with respect to the entire population of fillers. 
     
     
         3 . The filler-containing film according to  claim 1 , wherein the fillers are disposed in a hexagonal lattice, a square lattice or a rhombic lattice, and when three fillers are selected in order of proximity to any filler P 0 , a ratio of a maximum distance to a minimum distance among distances between the three fillers and the filler P 0  is 1.2 or less. 
     
     
         4 . The filler-containing film according to  claim 1 , wherein the fillers are exposed from the resin layer. 
     
     
         5 . The filler-containing film according to  claim 1 , further comprising a second resin layer having a minimum melt viscosity lower than that of the resin layer, wherein the second resin layer is laminated on the filler distributed layer. 
     
     
         6 . The filler-containing film according to  claim 1 , wherein a minimum melt viscosity of the entire resin layer constituting the filler-containing film is 200 to 4000 Pa·s. 
     
     
         7 . The filler-containing film according to  claim 5 , wherein the fillers bite the second resin layer. 
     
     
         8 . The filler-containing film according to  claim 1 , wherein
 an inclination or an undulation is formed in a surface of the resin layer near the fillers with respect to a tangent plane to a central portion of the resin layer surface between adjacent fillers,   if the inclination is present, resin is absent from a region between the surface of the resin layer around the filler in the inclination and the tangent plane,   if the undulation is present, an amount of the resin of the resin layer immediately above the filler in the undulation is smaller than that of the resin layer immediately above the filler, and   the surface of the resin layer immediately above the filler is flush with the tangent plane.   
     
     
         9 . The filler-containing film according to  claim 1 , wherein the filler is a conductive particle, the resin layer of the filler distributed layer is an insulating resin layer, and the filler-containing film is an anisotropic conductive film. 
     
     
         10 . A film bonded body comprising an article bonded to the filler-containing film according to  claim 1 . 
     
     
         11 . A connection structure, comprising a first article and a second article that are connected via the filler-containing film according to  claim 1 . 
     
     
         12 . A connection structure, comprising a first electronic component and a second electronic component that are anisotropically conductively connected via the filler-containing film according to  claim 9 . 
     
     
         13 . A method for producing a connection structure comprising pressure bonding a first article and a second article via the filler-containing film according to  claim 1 . 
     
     
         14 . The method for producing the connection structure according to  claim 13 , wherein
 the first article is a first electronic component,   the second article is a second electronic component,   the first electronic component and the second electronic component are anisotropically conductively connected to each other, and   the pressure bonding includes thermocompression bonding the first electronic component and the second electronic component via a filler-containing film, where the filler-containing film is an anisotropic conductive film having conductive particles as the fillers, and the resin layer of the filler distributed layer is an insulating resin layer.