US2021275186A1PendingUtilityA1
Detachment Mechanisms for Attachment Devices
Est. expirySep 3, 2033(~7.1 yrs left)· nominal 20-yr term from priority
Inventors:Jianlu Ma
A61B 2017/12063A61B 17/1214A61B 17/12113
62
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Claims
Abstract
The present invention relates to detachment mechanisms for delivering and releasing implantable devices into a body lumen. According to certain aspects, systems of the invention include a junction that couples an implantable device to a delivery member. The junction includes an anodic portion and a cathodic portion galvanically coupled to the anodic portion such that the anodic portion corrodes when exposed to an electrolytic fluid, thereby detaching the implantable device from the delivery member without application of energy from an external power source.
Claims
exact text as granted — not AI-modified1 - 37 . (canceled)
38 . A system for delivering an implantable device into a body lumen, the system comprising:
an implantable device; a delivery member; and a junction coupling the implantable device to the delivery member, the junction comprising:
a tubular anodic portion formed on a portion of the implantable device; and
a tubular cathodic portion having an inner bore and opposing first and second ends, with the first end overlapping a portion of the delivery member in a manner where the delivery member is nested inside the bore, and the second end overlapping a portion of the anodic portion and a portion of the implantable device.
39 . The system of claim 38 , wherein the anodic portion corrodes when exposed to an electrolytic fluid, thereby detaching the implantable device from the delivery member without application of energy from an external power source.
40 . The system of claim 38 , wherein the anodic portion is formed on and overlaps a proximal end of the implantable device, and the first end of the cathodic portion overlaps a distal end of the delivery member.
41 . The system of claim 38 , wherein the anodic portion is formed on the implantable device by dipping, physical deposition, chemical deposition, laser deposition/sputtering, or plating.
42 . The system of claim 39 , wherein the electrolytic fluid is selected from the group consisting of blood, saline, and a combination thereof.
43 . The system of claim 38 , wherein the cathodic portion comprises a material selected from the group consisting of platinum, platinum alloys, platinum-iridium alloys, tantalum, stainless steel, nickel-titanium alloys, and cobalt-chromium alloys.
44 . The system of claim 38 , wherein the anodic portion comprises a material selected from the group consisting of magnesium and magnesium alloys.Cited by (0)
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