Resin powder for solid freeform fabrication, device for fabricating solid freeform fabrication object, and resin powder

Abstract

A resin powder for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

What is claimed is: 
     
         1 . A resin powder suitable for solid freeform fabrication, having a ratio (Mv/Mn) of 2.00 or less, where Mv represents a volume average particle diameter and Mn represents a number average particle diameter and a ratio of melt mass-flow rate B to melt mass-flow rate A in a range of from greater than 0.80 to 1.20,
 wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15° C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15° C. lower than the melting point under a pressure of 0.1 kPa for four hours.   
     
     
         2 . The resin powder of  claim 1 , comprising an anti-degradation agent. 
     
     
         3 . The resin powder of  claim 2 , wherein the anti-degradation agent has a proportion in a range of from 0.02 to 5 percent by mass of a total mass of the resin powder. 
     
     
         4 . The resin powder of  claim 1 , further comprising:
 an anti-degradation agent comprising a metal chelate material, an ultraviolet absorber, a polymerization inhibitor, an antioxidant, or a mixture of two or more of any of these.   
     
     
         5 . The resin powder of  claim 1 , further comprising:
 an anti-degradation agent comprising a hindered phenolic compound, phosphorus-containing compound, sulfur-containing compound, copper acetate, or a mixture of two or more of any of these.   
     
     
         6 . The resin powder of  claim 1 , wherein the resin powder has a specific gravity of 0.8 g/mL or greater. 
     
     
         7 . The resin powder of  claim 1 , wherein the resin powder has a 50 percent cumulative volume particle diameter in a range of from 5 to 200 sm. 
     
     
         8 . The resin powder of  claim 1 , comprising a polyolefin, polyamide, polyester, polyarylketone, polyphenylene sulfide, liquid crystal polymer, polyacetal, polyimide, fluorochemical resin, or a mixture of two or more of any of these. 
     
     
         9 . The resin powder of  claim 10 , wherein the polyamide is present and comprises polyamide 410, polyamide 4T, polyamide 6, polyamide 66, polyamide MXD6, polyamide 610, polyamide 6T, polyamide 11, polyamide 12, polyamide 9T, polyamide 10T, aramid, or a mixture of two or more of any of these. 
     
     
         10 . The resin powder of  claim 10 , wherein the polyester is present and comprises polyethylene terephthalate, polybutylene terephthalate, polylactate, or a mixture of two or more of any of these. 
     
     
         11 . The resin powder of  claim 10 , wherein the polyarylketone is present and comprises polyether ether ketone, polyether ketone, polyether ketone ketone, or a mixture of two or more of any of these. 
     
     
         12 . The resin powder of  claim 1 , wherein a difference between a melting start temperature and a recystallization point is greater than 3° C. 
     
     
         13 . The resin powder of  claim 1 , having a melting point of 100° C. or higher as measured according to ISO 3146 regulation. 
     
     
         14 . A device configured for fabricating a solid freeform fabrication object, the device comprising:
 an accommodating device configured to accommodate a resin powder for solid freeform fabrication;   a supplying device configured to supply the resin powder for solid freeform fabrication; and   a layer-forming device configured to melt the resin powder supplied by the supplying device in a selected area to form a layer,   wherein the supplying device repeats supplying the resin powder and the layer forming device repeats forming the layer to laminate the layer to form a solid freeform fabrication object,   wherein the resin powder has a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A in a range of from greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15° C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15° C. lower than the melting point under a pressure of 0.1 kPa for four hours.