US2021289623A1PendingUtilityA1
Connection structure
Est. expiryJan 31, 2038(~11.6 yrs left)· nominal 20-yr term from priority
Inventors:Sakae Tanaka
H10W 72/07332H10W 72/01315G02F 1/13452H05K 3/321H05K 2201/0221H05K 3/10H05K 2203/0534H05K 2201/0133H05K 1/0306H10W 90/766
66
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Claims
Abstract
A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A connection structure comprising:
a first member having a first surface; at least one first electrode located on the first surface; a second member having a second surface opposed to the first surface; at least one second electrode opposed to the at least one first electrode and located on the second surface; a first resin and at least one conductive particle arranged in at least one first region between the at least one first electrode and the at least one second electrode, the at least one conductive particle including a particle core having elasticity coated with metals; and a second resin arranged in a second region surrounding the at least one first region between the first surface and the second surface, wherein the at least one first electrode overlaps the at least one first region and the second region, the second resin is in contact with the at least one first electrode and the at least one second electrode in the second region, and the first resin and the second resin have different compositions from each other.
2 . The connection structure according to claim 1 , wherein the first resin is in contact with the at least one first electrode and the at least one second electrode in the at least one first region.
3 . The connection structure according to claim 1 , wherein
the at least one conductive particle comprises a plurality of conductive particles, and the plurality of conductive particles is arranged in the at least one first region in a range of seven or less.
4 . The connection structure according to claim 1 , wherein
the at least one first region includes a plurality of first regions, and the plurality of first regions is separated from each other by 5 μm or more.
5 . The connection structure according to claim 1 , wherein
the at least one conductive particle are arranged between the at least one first electrode and the at least one second electrode in a range of seven per 400 □m 2 or more and twenty per 400 □m 2 or less.
6 . The connection structure according to claim 1 , wherein
the at least one conductive particle are arranged only between the at least one first electrode and the at least one second electrode, and the at least one conductive particle include the particle core with a highly-hard resin material coated with a rubber-like elastic resin or the particle core with a highly-hard inorganic material coated with a rubber-like inorganic elastic body.
7 . The connection structure according to claim 1 , wherein
the at least one conductive particle is in contact with the at least one first electrode and the at least one second electrode.
8 . The connection structure according to claim 1 , wherein
the at least one conductive particle is compressed by the at least one first electrode and the at least one second electrode.
9 . The connection structure according to claim 1 , wherein
the at least one first electrode includes a plurality of first electrodes, and an insulating film is arranged between the plurality of first electrodes on the first surface.
10 . The connection structure according to claim 1 , wherein
the second resin is in contact with the insulating film in the second region.Cited by (0)
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