Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device

Abstract

A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

1 - 113 . (canceled) 
     
     
         114 . A molded photosensitive assembly, characterized by comprising:
 an imaging assembly, wherein the imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board;   a molded base, wherein the molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base; and   a filter assembly, wherein the filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.   
     
     
         115 . The molded photosensitive assembly according to  claim 114 , wherein the molded base includes at least one first base portion and at least one second base portion, and each second base portion integrally extends inward from an inner circumferential surface of each first base portion along the circuit board, a first top surface of each first base portion is higher than a second top surface of the second base portion, so that each first base portion and each second base portion form each stepped peripheral groove of the molded base. 
     
     
         116 . The molded photosensitive assembly according to  claim 115 , wherein the circuit board includes a chip mounting region and an edge region located around the chip mounting region, and the photosensitive element includes a photosensitive region and a non-photosensitive region located around the photosensitive region, and the first base portion of the molded base embeds at least a part of the edge region of the circuit board, and the second base portion of the molded base embeds at least a part of the non-photosensitive region of the photosensitive element. 
     
     
         117 . The molded photosensitive assembly according to  claim 116 , wherein the first base portion embeds a circuit board outer portion of the edge region of the circuit board, and the second base portion embeds a circuit board connecting portion and a circuit board inner portion of the edge region of the circuit board, as well as a chip outer portion and a chip connecting portion of the non-photosensitive region of the photosensitive element; or
 wherein the first base portion of the molded base embeds a circuit board outer portion and a circuit board connecting portion of the edge region of the circuit board, and the second base portion embeds a circuit board inner portion of the edge region of the circuit board, as well as a chip outer portion and a chip connecting portion of the non-photosensitive region of the photosensitive element; or   wherein the first base portion of the molded base embeds a circuit board outer portion, a circuit board connecting portion and a circuit board inner portion of the edge region of the circuit board, and the second base portion embeds a chip outer portion, a chip connecting portion and a part of a chip inner portion of the non-photosensitive region of the photosensitive element; or   wherein the first base portion of the molded base embeds a circuit board outer portion, a circuit board connecting portion and a circuit board inner portion of the edge region of the circuit board, as well as a chip outer portion of the non-photosensitive region of the photosensitive element, and the second base portion embeds a chip connecting portion and a part of a chip inner portion of the non-photosensitive region of the photosensitive element.   
     
     
         118 . The molded photosensitive assembly according to  claim 117 , wherein the imaging assembly further includes at least one group of leads to conductively connect the photosensitive element and the circuit board through each lead, wherein a height of the second base portion is greater than an arc height of each lead, and the second base portion embeds each lead of the imaging assembly. 
     
     
         119 . The molded photosensitive assembly according to  claim 118 , wherein the imaging assembly further includes at least one group of electronic components, and each electronic component is mounted to the circuit board outer portion of the edge region of the circuit board, wherein a height of the first base portion of the molded base is greater than a height of each electronic component, and the first base portion embeds each electronic component of the imaging assembly. 
     
     
         120 . The molded photosensitive assembly according to  claim 119 , wherein the second top surface of the second base portion is lower than a top surface of the highest electronic component. 
     
     
         121 . The molded photosensitive assembly according to  claim 115 , wherein the circuit board includes a chip mounting region and an edge region located around the chip mounting region, wherein the first base portion and the second base portion of the molded base both embed a circuit board outer portion of the edge region of the circuit board. 
     
     
         122 . The molded photosensitive assembly according to  claim 121 , wherein the imaging assembly further includes at least one group of electronic components, and each electronic component is mounted to the circuit board outer portion of the edge region of the circuit board, wherein a height of the first base portion of the molded base is greater than a height of each electronic component, and the first base portion embeds each electronic component of the imaging assembly. 
     
     
         123 . The molded photosensitive assembly according to  claim 115 , wherein a first top surface of the first base portion and a second top surface of the second base portion are parallel to each other. 
     
     
         124 . The molded photosensitive assembly according to  claim 123 , wherein the first top surface of each first base portion of the molded base and a photosensitive surface of the photosensitive element are parallel to each other. 
     
     
         125 . The molded photosensitive assembly according to  claim 115 , wherein an inclination angle of a first inner circumferential surface of each first base portion relative to a photosensitive surface of the photosensitive element is less than 30°. 
     
     
         126 . The molded photosensitive assembly according to  claim 125 , wherein an inclination angle of a second inner circumferential surface of each second base portion relative to the photosensitive surface of the photosensitive element is less than 30°. 
     
     
         127 . The molded photosensitive assembly according to  claim 115 , wherein the filter assembly further includes at least one glue layer, and each glue layer is arranged between each filter element and each second base portion, so that each filter element is fixedly arranged on each second base portion of the molded base through each glue layer. 
     
     
         128 . The molded photosensitive assembly according to  claim 127 , wherein each glue layer is formed by curing glue applied to the second top surface of each second base portion, and each glue layer is located between a lower surface of each filter element and a second top surface of each second base portion. 
     
     
         129 . The molded photosensitive assembly according to  claim 128 , wherein each second base portion is further provided with at least one glue recess, wherein each glue recess is sunken downward from the second top surface of each second base portion to form a recess for holding the glue. 
     
     
         130 . The molded photosensitive assembly according to  claim 127 , wherein each glue layer is formed by curing glue applied to a lower surface of each filter element, and each glue layer is located between the lower surface of each filter element and the second top surface of each second base portion. 
     
     
         131 . The molded photosensitive assembly according to  claim 127 , further including a mounting gap, wherein the mounting gap is located between the filter element and the first inner circumferential surface of the first base portion. 
     
     
         132 . An electronic device, characterized by comprising:
 an electronic device body; and   at least one camera module, wherein each camera module is arranged in the electronic device body for capturing images, and includes:
 the molded photosensitive assembly according to  claim 114 ; and 
 at least one optical lens, wherein each optical lens is arranged on a photosensitive path of each photosensitive element of the imaging assembly of the molded photosensitive assembly, so that each light window provides a light path for each optical lens and each photosensitive element. 
   
     
     
         133 . A method for manufacturing a molded photosensitive assembly, characterized by comprising the following steps:
 mounting a photosensitive element and at least one group of electronic components to a circuit board, and conducting the photosensitive element and the circuit board to assemble an imaging assembly;   forming, by means of a molding process, a molded base which is used for embedding a part of the circuit board and a part of the photosensitive element and has a stepped peripheral groove, and forming a light window through the stepped peripheral groove, wherein a photosensitive region of the photosensitive element corresponds to the light window of the molded base, so as to form a semi-finished molded photosensitive assembly with an integrated structure; and   correspondingly arranging a filter element of a filter assembly in the stepped peripheral groove of the molded base of the semi-finished molded photosensitive assembly to assemble a molded photosensitive assembly, wherein the photosensitive region of the photosensitive element corresponds to the filter element.