Connecting structure device between analysis electronics and probe in cylinder systems

Abstract

The invention relates to a device for guiding an electromagnetic wave within a cylinder head of a cylinder system, wherein the device comprises analysis electronics arranged in or on the cylinder head and a probe located in the cylinder head, as well as a connecting structure guiding the electromagnetic wave and arranged between the analysis electronics and the probe for versatile positioning of the analysis electronics, the connecting structure having a first signal connection (101, 201, 301, 401, 501a, 501b, 601, 701) for connection to the probe and a second signal connection (314, 514a, 514b, 714) for connection to the analysis electronics.

1 . A device for guiding an electromagnetic wave within a cylinder head of a cylinder system, comprising:
 analysis electronics arranged in or on the cylinder head;   a probe located in the cylinder head; and   a connecting structure configured to guide the electromagnetic wave, wherein the connecting structure is arranged between the analysis electronics and the probe, and the connecting structure comprises a first signal connection connected to the probe and a second signal connection connected to the analysis electronics.   
     
     
         2 . The device of  claim 1 , wherein the connecting structure is flexible. 
     
     
         3 . The device of  claim 1 , wherein the connecting structure is rigid. 
     
     
         4 . The device of  claim 1 , wherein the connecting structure is a coaxial connection configured to transmit the electromagnetic wave. 
     
     
         5 . The device of  claim 1 , wherein the first signal connection and the second signal connection are reconfigurable to different angles with respect to each other. 
     
     
         6 . The device of  claim 1 , wherein the first signal connection and/or the second signal connection are/is configured on a printed circuit board ( 104 ,  404 ). 
     
     
         7 . The device of  claim 1 , wherein the first signal connection and/or the second signal connection are/is configured as a coaxial connection on a printed circuit board. 
     
     
         8 . The device of  claim 1 , wherein the connecting structure further comprises strip lines. 
     
     
         9 . The device of  claim 1 , comprising a galvanic contact between the first signal connection and the second signal connection. 
     
     
         10 . The device of  claim 9 , wherein the galvanic contact is configured as an element with spring effect. 
     
     
         11 . The device of  claim 10 , wherein the galvanic contact is configured as a spring contact, a conductive elastomer, or a conductive film-over-foam contact. 
     
     
         12 . The device of  claim 9 , wherein the galvanic contact is configured as a plug-in connection or a clamping connection. 
     
     
         13 . The device of  claim 9 , wherein the galvanic contact is configured as a screw connection or a press connection. 
     
     
         14 . The device of  claim 13 , wherein the screw connection or the press connection is: configured as
 an interference fit; or   a press fit.   
     
     
         15 . The device of  claim 9 , wherein the galvanic contact is configured as a solder connection. 
     
     
         16 . The device of  claim 1 , wherein the first signal connection and/or the second signal connection are/is galvanically isolated, and wherein the device further comprises coupling structures configured as one or more signal lines guided in parallel. 
     
     
         17 . The device of  claim 16 , wherein the galvanic isolation is configured between the first signal connection and the analysis electronics. 
     
     
         18 . The device of  claim 16 , further comprising directional couplers integrated into the one or more signal lines. 
     
     
         19 . The device of  claim 16 , further comprising calibration structures integrated into the one or more signal lines. 
     
     
         20 . The device of  claim 1 , further comprising analog or digital temperature sensors configured to monitor a temperature, wherein the temperature sensors are provided at the connecting structure. 
     
     
         21 . The device of  claim 1 , wherein the electromagnetic wave has a frequency in a range from 10 MHz to 100 GHz.