Processes for in-mold coating systems for molding, and products formed therefrom
Abstract
Disclosed are processes for In-Mold coating of a substrate. The processes include: introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.
Claims
exact text as granted — not AI-modified1 . A process for In-Mold coating, comprising:
introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.
2 . The process according to claim 1 , wherein the secondary mixer is a peanut mixer, wherein the mixing of the intermediate composition to form the coating composition is a kinetic mixing.
3 . The process according to claim 1 , wherein the secondary mixer is partially formed in the mold and partially formed in the substrate.
4 . The process according to claim 1 , wherein introducing the coating composition into the mold containing the substrate further comprises introducing at least one of the intermediate composition and the coating composition into a dump well in communication with the mold, and further comprising:
limiting a flow of the curable composition wherein the introducing of the curable composition to the mixhead is decreased to a second pressure less than the first elevated pressure to form a non-homogenous mixture of the first and second polymeric components; and limiting entry of the non-homogenous mixture into the mold by a volume of the dump well.
5 . The process according to claim 4 , wherein the dump well comprises the secondary mixer.
6 . The process according to claim 4 , wherein the dump well comprises at least two channels.
7 . The process according to claim 4 , further comprising positioning the dump well between the mixhead and the secondary mixer.
8 . The process according to claim 4 , further comprising positioning the secondary mixer between the dump well and the mixhead.
9 . (canceled)
10 . A process for In-Mold coating comprising:
introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form a coating composition; and introducing the coating composition into a mold containing a substrate via at least two channels to form a curable coating on a surface of the substrate.
11 . The process according to claim 1 , where the first polymeric component comprises an isocyanate-reactive group and the second polymeric component comprises a polyisocyanate.
12 . The process according to claim 11 , wherein the isocyanate-reactive group comprises a polyol.
13 . The process according to claim 1 , wherein the first elevated pressure is at least 1600 psi.
14 . The process according to claim 1 , wherein the coating composition is homogeneous.
15 . The process according to claim 1 , further comprising curing the curable coating to form a cured coating on the substrate, the cured coating having a thickness between 50 micrometers and 100 micrometers.
16 . The process according to claim 15 , wherein the cured coating thickness is between 80 micrometers and 100 micrometers.
17 . The process according to claim 15 , wherein the cured coating is substantially free of defects.
18 . The process according to claim 15 , wherein the curable coating composition is cured:
at a mold temperature of 75° C. to 105° C.; and for a period between 10 and 90 seconds.
19 . The process according to claim 1 , further comprising introducing the coating composition into the mold via at least two channels.
20 - 46 . (canceled)Join the waitlist — get patent alerts
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