US2021355568A1PendingUtilityA1

Silicon Alloy Steel

Assignee: CARTER MELVIN KEITHPriority: May 18, 2020Filed: May 18, 2020Published: Nov 18, 2021
Est. expiryMay 18, 2040(~13.8 yrs left)· nominal 20-yr term from priority
C22C 38/02C22C 33/04C22C 38/04
48
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Claims

Abstract

Pure silicon is a brittle insulator and, with addition of doping elements, performs as a semiconductor. It has found widespread use in computer integrated circuits as well as other semiconducting devices used in communication, electrical switching and power control. Silicon has also been used in solar collectors as active photovoltaic devices. The present application discloses formation and use of certain silicon alloys that take advantage of silicon's relatively low density near 2.33 grams per cubic centimeter and high melting temperature of 1,410° C. Alloys prepared with two to six percent boron, beryllium or mixtures thereof are strong and tough. Silicon steel containing near 2 percent alloying boron is hard while silicon alloys containing near 6 percent boron are tough and more flexible.

Claims

exact text as granted — not AI-modified
What is claimed: 
     
         1 . A process for formation of silicon steel alloy comprising melting together silicon with selected 2 to 6 percent boron in the temperature range comprising 1,400° C. to 1,800° C. in a suitable crucible in an inert atmosphere. 
     
     
         2 . A process for formation of silicon steel alloy comprising melting together silicon with selected 2 to 6 percent beryllium in the temperature range comprising 1,200° C. to 1,600° C. in a suitable crucible in an inert atmosphere. 
     
     
         3 . A process for formation of silicon steel alloy comprising melting together silicon with selected 2 to 6 percent boron, up to 2 percent of manganese for toughness and up to 0.5 percent sulfur for corrosion resistance in the temperature range comprising 1,400° C. to 1,800° C. in a suitable crucible in an inert atmosphere.

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