Methods of making z-shielding

Abstract

Aspects relate to building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

1 . A laminate, comprising:
 a layered material including
 a substrate having a substrate surface with a Z-grade; and 
 a first metal bonded onto the substrate surface, wherein the first metal has a higher Z-grade than the substrate surface; and 
   a polymer layer infused into the layered material.   
     
     
         2 . The laminate of  claim 1 , wherein the first metal comprises a compound selected from the group consisting of tantalum, copper, tungsten, titanium, aluminum, rhenium, alloys of one or more of tantalum, copper, tungsten, titanium, aluminum, rhenium, and combinations thereof. 
     
     
         3 . The laminate of  claim 1 , wherein the polymer comprises a compound selected from the group consisting of epoxy, polyimide, cyanate ester, and mixtures thereof. 
     
     
         4 . The laminate of  claim 1 , wherein the substrate surface comprises metal, glass or graphite fibers. 
     
     
         5 . The laminate of  claim 1 , further comprising a second metal having a higher Z-grade than the substrate surface bonded to the first metal. 
     
     
         6 . The laminate of  claim 5 , wherein the second metal is different from the first metal, and comprises a compound selected from the group consisting of tantalum, copper, tungsten, titanium, aluminum, rhenium, and alloys of one or more of tantalum, copper, tungsten, titanium, aluminum, rhenium, and combinations thereof. 
     
     
         7 . The laminate of  claim 1 , wherein the first metal is patterned in a shape of a thermal heat pipe. 
     
     
         8 . The laminate of  claim 3 , wherein the compound of the polymer layer comprises a conductive filler to provide increased electro-magnetic-interference resistance. 
     
     
         9 . The laminate of  claim 1 , wherein the laminate forms a radiation shielding cover or structure. 
     
     
         10 . The laminate of  claim 9 , wherein the laminate is shaped into a structure selected from the group consisting of slab, thermal barrier, vault, spot enclosure, PCI card chassis structures, and combinations thereof. 
     
     
         11 . The laminate of  claim 1 , wherein the laminate is shaped into a structure selected from the group consisting of slab, thermal barrier, vault, spot enclosure, PCI card chassis structures, and combinations thereof.