Heat transfer assembly

Abstract

A heat transfer assembly includes a sheath which in one embodiment is elliptical in cross-section and in another embodiment has a complex cross-section with flat wall sections and curved wall sections. The sheath is elastically deformable so as to accept a heat transfer element sub-assembly. Once installed, the sheath holds the sub-assembly in place by an interference fit.

1 . A heat transfer assembly comprising:
 a tubular sheath including a wall that defines an internal hollow space; and   a heat transfer sub-assembly located in said internal hollow space, said heat transfer sub-assembly comprising at least one semiconductor heat transfer device located between first and second electrodes;   wherein said heat transfer sub-assembly is retained within said internal hollow space with an interference fit between said wall and said heat transfer sub-assembly.   
     
     
         2 . The heat transfer assembly as set forth in  claim 1 , wherein said tubular sheath is resiliently deformed relative to its free state by the presence of said heat transfer sub-assembly in said internal hollow space such that said tubular sheath exerts clamping forces on said heat transfer sub-assembly that clamp said heat transfer sub-assembly in said internal hollow space. 
     
     
         3 . The heat transfer sub-assembly as set forth in  claim 1 , wherein said heat transfer sub-assembly is electrically insulated from said tubular sheath by a layer of electrically insulative and thermally conductive material located between said heat transfer sub-assembly and said wall of said tubular sheath. 
     
     
         4 . The heat transfer assembly as set forth in  claim 3 , wherein said electrically insulative and thermally conductive layer comprises a dielectric film that is wrapped completely around said first and second electrodes. 
     
     
         5 . The heat transfer assembly as set forth in  claim 1 , wherein said at least one semiconductor heat transfer device comprises at least one of: (i) a PTC heating device; (ii) a Peltier heat transfer device. 
     
     
         6 . The heat transfer assembly as set forth in  claim 1 , wherein said first and second electrodes comprises respective inner faces that are arranged in opposed facing relation and define a slot there between in which said at least one semiconductor heat transfer device is located. 
     
     
         7 . The heat transfer assembly as set forth in  claim 6 , wherein a plurality of said semiconductor heat transfer devices are located in said slot and are axially spaced apart from each other along a longitudinal axis of the sheath. 
     
     
         8 . The heat transfer assembly as set forth in  claim 3 , wherein:
 said wall of said tubular sheath is elliptical in cross-section and said internal hollow space has an elliptical cross-section defined by a major axis and a minor axis; and,   respective outer surfaces of the first and second electrodes are shaped to conform to said wall such that said heat transfer sub-assembly is in intimate contact with said wall.   
     
     
         9 . The heat transfer assembly as set forth in  claim 8 , wherein a majority of a perimeter of said wall of said sheath is abutted with said heat transfer sub-assembly. 
     
     
         10 . The heat transfer assembly as set forth in  claim 8 , further comprising first and second filler rods located in the internal hollow space respectively adjacent opposite first and second lateral sides of the heat transfer sub-assembly, said first filler rod located between said heat transfer sub-assembly and a first vertex of the major axis and said second filler rod located between said heat transfer sub-assembly and a second vertex of the major axis. 
     
     
         11 . The heat transfer assembly as set forth in  claim 8 , wherein application of opposed inwardly directed deformation forces exerted on said sheath along said major axis increases a height of said internal hollow space along said minor axis and eliminates said interference fit between said wall of said sheath and said heat transfer sub-assembly. 
     
     
         12 . The heat transfer assembly as set forth in  claim 3 , wherein said wall of said tubular sheath defines said sheath to have a complex geometry comprising a planar top wall, a planar bottom wall, and first and second side walls that extend between and connect the top and bottom walls, each of said first and second side walls comprising first and second flat portions and an outwardly extending portion located between the first and second flat portions. 
     
     
         13 . The heat transfer assembly as set forth in  claim 12 , wherein application of opposed inwardly directed deformation forces on said outwardly extending portions of said first and second side walls increases a distance between said planar top wall and said planar bottom wall and eliminates said interference fit between said wall of said sheath and said heat transfer sub-assembly. 
     
     
         14 . The heat transfer assembly as set forth in  claim 3 , wherein said tubular sheath comprises a metallic material. 
     
     
         15 . The heat transfer assembly as set forth in  claim 14 , further comprising fins connected to said sheath for increased heat transfer between said sheath and an environment surrounding said sheath. 
     
     
         16 . A method of manufacturing a heat transfer assembly comprising:
 providing a tubular sheath including a wall that defines an internal hollow space;   resiliently elastically deforming said sheath from a free or rest state to an elastically deformed state in which a cross-sectional width of said internal hollow space decreases and a cross-sectional height of said internal hollow space increases;   inserting a heat transfer sub-assembly into said internal hollow space through an open end of said tubular sheath while said tubular sheath remains deformed;   allowing the tubular sheath to resiliently move toward said free or rest state whereby said heat transfer sub-assembly is resiliently clamped in said internal hollow space of said tubular sheath.   
     
     
         17 . The method as set forth in  claim 16 , wherein said tubular sheath defines an elliptical cross-section, and said step of resiliently elastically deforming comprises applying opposed inwardly directed first and second deformation forces coincident with a major axis of the elliptical cross-section. 
     
     
         18 . The method as set forth in  claim 16 , wherein:
 said wall of said tubular sheath defines said sheath to have a complex geometry comprising a planar top wall, a planar bottom wall, and first and second side walls that extend between and connect the top and bottom walls, each of said first and second side walls comprising first and second flat portions and an outwardly extending portion located between the first and second flat portions; and   said step of resiliently elastically deforming comprises applying opposed inwardly directed first and second deformation forces respectively to said outwardly extending portions of said first and second side walls such that said planar top wall and said planar bottom wall move away from each other.   
     
     
         19 . A heat transfer assembly comprising:
 a first electrode including an outer face and an inner face;   a second electrode including an outer face and an inner face;   a heat transfer device disposed between the inner faces of the first and second electrodes;   a sheath accommodating the first and second electrodes and the heat transfer device disposed between them, wherein the sheath comprises a resilient metallic material including a wall comprising an inner surface and an outer surface;   wherein the outer faces of the first and second electrodes are shaped so as to conform to the inner surface of the wall of the sheath, so that the outer faces of the first and second electrodes lie adjacent the inner surface of the wall of the sheath; and,   wherein the sheath resiliently urges the first and second electrodes toward each other so as to clamp the heat transfer device between the electrodes.   
     
     
         20 . The heat transfer assembly of  claim 19  further comprising a dielectric layer disposed between the inner surface of the wall of the sheath and the outer faces of the first and second electrodes.