Antimicrobial adhesive composition with copper nanoparticles for dentures

Abstract

The present invention concerns a new antimicrobial denture adhesive composition useful to be used for fixing dentures, which includes copper nanoparticles (CuNPs) that provides antimicrobial properties against dental pathogens such as Candida albicans, Streptococcus mutans, Staphylococcus aureus and Aggregatibacter actinomycetemcomitans. Surprisingly, the composition for a denture adhesive comprising copper nanoparticles (CuNPs) not only shown excellent antimicrobial properties, but also improved adhesive properties in comparison with other denture adhesives existing currently in the marked, which do not contain said CuNPs.

1 . Antimicrobial denture adhesive composition, comprising:
 a cellulose polymer or its derivative;   a copolymer of methyl vinyl ether and maleic anhydride (PVM/MA) or their derivatives;   copper nanoparticles (CuNPs); and   a hydrophobic vehicle.   
     
     
         2 . Antimicrobial denture adhesive composition according to  claim 1 , comprising:
 mineral oil between 20.0 to 30.0 w/w %;   petrolatum between 25.0 to 35.0 w/w %:   copolymer of methyl vinyl ether and maleic anhydride (PVM/MA) between 28.0 to 37.0 w/w %;   carboxymethylcellulose between 14.0 to 23.0 ; and   copper nanoparticles (CuNPs) between 0.030-0.100 w/w %.   
     
     
         3 . Antimicrobial denture adhesive composition according to  claim 1 , wherein copper nanoparticles (CuNPs) have dimensions of 5 to 200 nm. 
     
     
         4 . Antimicrobial denture adhesive composition according to  claim 1 , wherein copper nanoparticles (CuNPs) have a morphology selected from the group consisting in spherical, tubular, cubic, fibrous, wire, laminar and any other morphology having at least one of its dimensions in nanometric scale. 
     
     
         5 . Antimicrobial denture adhesive composition according to  claim 1 , wherein said copper nanoparticles (CuNPs) contain copper having an oxidation number of 0, 1, 2 or one intermediate oxidation state. 
     
     
         6 . Antimicrobial denture adhesive composition according to  claim 1 , wherein said copper nanoparticles (CuNPs) has a structure of copper supported on ceramic nanoparticles selected from the group consisting in silica, clay, zeolite, titanium and zirconium oxides.