Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via

Abstract

A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.

What is claimed is: 
     
         1 . A method of fabricating a plurality of device packages, comprising:
 fabricating at least two devices directly on a glass substrate, each of the at least two devices having at least one electrical port;   fabricating a glass cover that comprises at least two glass caps, one for each of the two devices, each of the at least two glass caps having:
 (i) at least one side wall; 
 (ii) a void that extends through the glass cap and through a glass pillar from a top surface of the glass cap to a bottom surface of the glass pillar; and 
 (iii) an electrically conductive plug disposed within the void, the electrically conductive plug configured to be electrically coupled to the at least one electrical port of a respective device and to hermetically seal the void; 
   disposing the glass cover on the glass substrate, such that each of the at least two glass caps covers a corresponding device on the glass substrate to form a respective device package, and such that each of the at least two glass caps provides a cavity that encompasses the corresponding device;   attaching the at least one side wall to the glass substrate to provide a hermetic seal, to isolate a first environment within the cavity from a second environment external to the device package; and   electrically coupling each of the electrically conductive plugs to a respective electrical port at the top surface of the glass cap.   
     
     
         2 . The method of  claim 1 , further comprising fabricating the glass cover as an array of four or more glass caps arranged in an n by m grid, n being a first integer greater than one, and m being a second integer greater than one. 
     
     
         3 . The method of  claim 1 , further comprising disposing the glass cover on the glass substrate, such that each of the at least two glass caps covers at least two devices on the glass substrate to form a device package for the respective at least two devices. 
     
     
         4 . The method of  claim 1 , further comprising cutting the glass substrate along one or more delineations between each pair of the two or more glass caps, such that the hermetic seal of each respective cavity is maintained. 
     
     
         5 . The method of  claim 1 , further comprising disposing an electrical conductor on the glass substrate, a first end of the electrical conductor electrically coupled to an electrical port of at least one of the at least two devices, and a second end of electrical conductor electrically coupled to an electrical port on the glass substrate outside of the first environment within the cavity. 
     
     
         6 . The method of  claim 1 , wherein fabricating at least two devices directly on a glass substrate further comprises integrating the at least two devices on the glass substrate using a series deposition-lithography-pattern etch process. 
     
     
         7 . The method of  claim 1 , wherein attaching the at least one side wall to the glass substrate further comprises implementing a bond between the at least one side wall and the glass substrate by one of (i) metal compression, (ii) eutectic bonding, (iii) laser bonding, (iv) glass frit, and (v) anodic wafer bonding. 
     
     
         8 . The method of  claim 1 , further comprising disposing a re-distribution layer on the top surface of the glass cap, and electrically coupling the redistribution layer to the electrically conductive plug. 
     
     
         9 . The method of  claim 1 , further comprising forming the glass cover such that the glass cap and the at least one side wall comprise a single integrated component. 
     
     
         10 . The method of  claim 1 , further comprising fabricating the at least one side wall and the glass substrate such that the at least one side wall and the glass substrate comprise a single integrated component.