Photographing device and unmanned aerial vehicle

Abstract

A photographing device includes a camera module assembly, a glass disposed external to the camera module assembly to protect the camera module assembly, a heating element disposed on the glass and a controller configured to control the heating element to heat the glass.

What is claimed is: 
     
         1 . A photographing device, comprising:
 a camera module assembly;   a glass disposed external to the camera module assembly to protect the camera module assembly;   a heating element disposed on the glass; and   a controller configured to control the heating element to heat the glass.   
     
     
         2 . The photographing device of  claim 1 , wherein the camera module assembly includes a circuit board, an imaging sensor loaded on the circuit board, and a lens module assembly loaded on the circuit board, and wherein the imaging sensor is received in the lens module assembly. 
     
     
         3 . The photographing device of  claim 2 , wherein the heating element includes a resistor, the resistor is electrically connected with the circuit board, and the heating element is configured to heat the glass using heat generated by supplying a current through the resistor. 
     
     
         4 . The photographing device of  claim 3 , wherein
 the resistor is disposed at an external surface of the glass, or   the resistor is disposed inside the glass.   
     
     
         5 . The photographing device of  claim 2 , wherein the heating element includes a conductive coating, the conductive coating is electrically connected with the circuit board, and the heating element is configured to heat the glass using heat generated by supplying a current through the conductive coating. 
     
     
         6 . The photographing device of  claim 5 , wherein the heating element also includes a resistor, the resistor is disposed inside the glass, and the heating element is configured to heat the glass using heat generated by supplying a current through the resistor and the conductive coating. 
     
     
         7 . The photographing device of  claim 2 , further comprising a front cover configured to cover the camera module assembly, wherein the glass is configured to seal an outer side of the front cover that is away from the camera module assembly using a UV curable glue. 
     
     
         8 . The photographing device of  claim 2 , further comprising a front cover and a dust-proof cotton, wherein the front cover is configured to cover the camera module assembly, and the dust-proof cotton is disposed between the front cover and the camera module assembly. 
     
     
         9 . The photographing device of  claim 2 , further comprising a front cover, a back cover, and a sealing glue, wherein the front cover and the back cover are configured to couple together to form a receiving space, the camera module assembly is received in the receiving space, and the sealing glue is disposed between the back cover and the circuit board. 
     
     
         10 . The photographing device of  claim 2 , further comprising a front cover, a back cover, and a hygroscopic material, wherein the front cover and the back cover are configured to couple together to form a receiving space, the camera module assembly is received in the receiving space, the hygroscopic material is disposed in the receiving space, and the hygroscopic material is configured to remove water content from an interior of the photographing device. 
     
     
         11 . An unmanned aerial vehicle (“UAV”), comprising:
 a gimbal; and 
 a photographing device disposed on the gimbal, the photographing device including:
 a camera module assembly; 
 a glass disposed external to the camera module assembly to protect the camera module assembly; 
 a heating element disposed on the glass; and 
 a controller configured to heat the glass. 
 
 
     
     
         12 . The UAV of  claim 11 , wherein the camera module assembly includes a circuit board, an imaging sensor loaded on the circuit board, and a lens module assembly loaded on the circuit board, and wherein the imaging sensor is received in the lens module assembly. 
     
     
         13 . The UAV of  claim 12 , wherein the heating element includes a resistor electrically connected with the circuit board, and wherein the heating element is configured to heat the glass using heat generated by supplying a current through the resistor. 
     
     
         14 . The UAV of  claim 13 , wherein
 the resistor is disposed at an external surface of the glass, or   the resistor is disposed inside the glass.   
     
     
         15 . The UAV of  claim 12 , wherein the heating element includes a conductive coating electrically connected with the circuit board, and wherein the heating element is configured to heat the glass using heat generated by supplying a current to the conductive coating. 
     
     
         16 . The UAV of  claim 15 , wherein the heating element also includes a resistor disposed inside the glass, and wherein the heating element is configured to heat the glass using heat generated by supplying a current through the resistor and the conductive coating. 
     
     
         17 . The UAV of  claim 12 , wherein the photographing device also includes a front cover configured to cover the camera module assembly, and wherein the glass is configured to seal an outer side of the front cover that is away from the camera module assembly through a UV curable glue. 
     
     
         18 . The UAV of  claim 12 , wherein the photographing device also includes a front cover and a dust-proof cotton, the front cover covers the camera module assembly, and the dust-proof cotton is disposed between the front cover and the camera module assembly. 
     
     
         19 . The UAV of  claim 12 , wherein the photographing device also includes a front cover, a back cover, and a sealing glue, and wherein the front cover and the back cover are configured to couple together to form a receiving space, the camera module assembly is received in the receiving space, and the sealing glue is disposed between the back cover and the circuit board. 
     
     
         20 . The UAV of  claim 12 , wherein the photographing device also includes a front cover, a back cover, and a hygroscopic material, and wherein the front cover and the back cover are configured to couple together to form a receiving space, the camera module assembly is received in the receiving space, the hygroscopic material is disposed in the receiving space, and the hygroscopic material is configured to remove water content from an interior of the photographing device.