Methods of oled display fabrication suited for deposition of light enhancing layer

Abstract

A method for manufacturing an organic light-emitting diode (OLED) structure includes depositing a light extraction layer (LEL) over a stack of OLED layers by directing fluid droplets of a LEL precursor to an array of well structures separated by plateau areas. Each well structure includes a recess with sidewalls and a floor, and the plateau areas have rounded top surfaces such that the droplets of the LEL precursor are guided into recesses of the well structures. The droplets of the LEL precursor are cured to solidify the LEL in the recess.

What is claimed is: 
     
         1 . A method for manufacturing an organic light-emitting diode (OLED) structure, the method comprising:
 depositing a light extraction layer (LEL) over a stack of OLED layers by directing fluid droplets of a LEL precursor to an array of well structures separated by plateau areas, each well structure including a recess with sidewalls and a floor, and wherein the plateau areas have rounded top surfaces such that the droplets of the LEL precursor are guided into recesses of the well structures; and   curing the droplets of the LEL precursor to solidify the LEL in the recess.   
     
     
         2 . The method of  claim 1 , further comprising:
 after depositing the LEL precursor, using an air blade to break connections of the LEL precursor between adjacent well structures.   
     
     
         3 . The method of  claim 2 , further comprising:
 delivering a layer of a fluid precursor of a light extraction layer (LEL) over a stack of OLED layers that are formed on an array of wells separated by plateau areas so at least partially the wells;   scanning the air blade across the stack of OLED layers to break connections of the fluid precursor between adjacent wells; and   curing the fluid precursor to form solidified LEL material in the wells.   
     
     
         4 . The method of  claim 1 , comprising:
 forming the dielectric layer on the substrate;   forming recesses in the dielectric layer to provide the array of well structures; and   depositing the stack of OLED layers over the dielectric layer and into the array of well structures.   
     
     
         5 . The method of  claim 4 , wherein forming the recesses comprises depositing and patterning the dielectric layer, reflowing the dielectric layer, and etching to form the recesses in the dielectric layer and to round the top surface of the plateaus. 
     
     
         6 . The method of  claim 5 , wherein the dielectric layer comprises a photoresist layer. 
     
     
         7 . The method of  claim 5 , wherein reflowing the photoresist layer comprises raising a temperature of the dielectric layer sufficiently close to a glass transition temperature or melting temperature of the photoresist layer to cause reflowing. 
     
     
         8 . The method of  claim 1 , comprising before depositing the LEL layer depositing a UV blocking layer, and wherein curing the curing the droplets of LEL precursor comprises UV-curing. 
     
     
         9 . The method of  claim 8 , comprising depositing the UV-blocking layer to extend over rounded corners of the plateau areas. 
     
     
         10 . The method of  claim 1 , wherein directing fluid droplets of LEL precursor comprises droplet ejection printing from a nozzle of a printhead that scans laterally across the array of well structures. 
     
     
         11 . The method of  claim 1 , comprising forming the array of well structures separated by plateau areas by depositing a layer of polymeric material and patterning the layer of polymeric material to form recesses that provide the wells. 
     
     
         12 . The method of  claim 11 , comprising heating the patterned layer of polymeric material to cause reflow of the layer of polymeric material to form the rounded top surfaces. 
     
     
         13 . The method of  claim 12 , wherein reflow of the layer of polymeric material causes sloped sidewalls to be formed. 
     
     
         14 . The method of  claim 1 , wherein a peak of the rounded top surface of the rounded plateau is about 5 to 50% higher than a depth of the well. 
     
     
         15 . A method for manufacturing an organic light-emitting diode (OLED) structure, the method comprising:
 depositing a light extraction layer (LEL) over a stack of OLED layers by directing fluid droplets of a LEL precursor to an array of well structures separated by plateau areas, each well structure including a recess with sidewalls and a floor; and   using an air blade to break connections of the LEL precursor between adjacent well structures on the plateau areas; and   curing the LEL precursor to form solidified LEL material in the wells.   
     
     
         16 . The method of  claim 15 , wherein the air blade breaks connections and the LEL precursor accumulates over the well to form a convex top surface over the well. 
     
     
         17 . The method of  claim 16 , wherein curing the LEL precursor causes the solidified LEL material to retains the convex top surface. 
     
     
         18 . The method of  claim 15 , wherein the air blade breaks connections and the LEL precursor accumulates has a generally planar top surface in the well.