Impinging jet coldplate for power electronics with enhanced heat transfer

Abstract

A coldplate for removing heat from one or more heat sources, such as power electronics devices, includes a baseplate including a first surface in thermally-conductive communication with the heat sources. The baseplate includes a second surface opposite the first surface to transfer heat into a cooling fluid in contact therewith. The second surface includes a peripheral flange surrounding a central region having a plurality of parallel ribs, which increase the surface area to improve heat transfer from the baseplate and into the fluid. A housing abuts the peripheral flange of the baseplate to define a cooling passage for circulation of the cooling fluid. A jet-array plate subdivides the cooling passage into a supply header and a main channel and defines a plurality of orifices to convey the fluid into the main channel and to direct the fluid toward predetermined zones on the baseplate.

1 . A coldplate comprising:
 a baseplate of thermally-conductive material including a first surface and a second surface opposite said first surface, with said first surface configured to be in thermally-conductive communication with a plurality of heat sources;   a housing and said baseplate together defining a cooling passage for circulation of a cooling fluid to remove heat from said baseplate;   a jet-array plate disposed in said cooling passage and extending parallel to and spaced apart from said baseplate to subdivide said cooling passage into a supply header opposite said baseplate and a main channel extending between said jet-array plate and said baseplate;   said jet-array plate defining a plurality of orifices extending therethrough to convey fluid from said supply header and into said main channel, with said orifices being configured to direct the fluid toward predetermined zones on said second surface of said baseplate.   
     
     
         2 . The coldplate of  claim 1 , wherein each of the heat sources is directly aligned with a corresponding one of the predetermined zones on said second surface of said baseplate. 
     
     
         3 . The coldplate of  claim 1 , wherein said baseplate extends in a generally flat plane, and wherein a central region of said baseplate defines a plurality of fins extending transverse to the generally flat plane of said baseplate and into said cooling passage. 
     
     
         4 . The coldplate of  claim 3 , wherein said fins of said plurality of fins extend parallel to one another. 
     
     
         5 . The coldplate of  claim 3 , wherein said fins of said plurality of fins have a generally rectangular cross-section. 
     
     
         6 . The coldplate of  claim 3 , wherein said fins of said plurality of fins are formed in said baseplate by machining or by compressive force. 
     
     
         7 . The coldplate of  claim 3 , wherein said fins of said plurality of fins are formed in said baseplate by casting. 
     
     
         8 . The coldplate of  claim 3 , wherein said fins of said plurality of fins are formed in said baseplate by  3 D printing. 
     
     
         9 . The coldplate of  claim 1 , wherein at least some of said plurality of orifices are generally cylindrical. 
     
     
         10 . The coldplate of  claim 1 , wherein at least some of said plurality of orifices include a frustoconical section. 
     
     
         11 . The coldplate of  claim 1 , further comprising:
 a second baseplate of thermally-conductive material including a first surface and a second surface opposite said first surface, with said first surface configured to be in thermally-conductive communication with a second plurality of heat sources;   a second jet-array plate disposed in said cooling passage and extending parallel to and spaced apart from said second baseplate to separate said supply header from a second main channel extending between said second jet-array plate and said second baseplate;   said second jet-array plate defining a plurality of second orifices extending therethrough to convey fluid from said supply header and into said second main channel, with said second orifices being configured to direct the fluid toward predetermined zones on said second surface of said second baseplate.   
     
     
         12 . The coldplate of  claim 11 , wherein said second baseplate extends parallel to and spaced apart from said baseplate, with said supply header disposed therebetween. 
     
     
         13 . The coldplate of  claim 11 , wherein said second baseplate extends in a generally flat plane, and wherein a central region of said second baseplate defines a plurality of fins extending transverse to the generally flat plane of said second baseplate and into said cooling passage. 
     
     
         14 . An enclosure for an electronic device including the coldplate of  claim 1 . 
     
     
         15 . The enclosure of  claim 14 , wherein the electronic device comprises a printed circuit board disposed parallel to said first surface of said baseplate. 
     
     
         16 . The coldplate of  claim 1 , wherein said jet array plate is spaced apart from said baseplate, with no portion of said jet array plate extending above a lowest surface of said baseplate. 
     
     
         17 . A coldplate comprising:
 a baseplate of thermally-conductive material including a first surface and a second surface opposite said first surface, with said first surface configured to be in thermally-conductive communication with a plurality of heat sources;   a housing and said baseplate together defining a cooling passage for circulation of a cooling fluid to remove heat from said baseplate;   a jet-array plate disposed in said cooling passage and extending parallel to and spaced apart from said baseplate to subdivide said cooling passage into a supply header opposite said baseplate and a main channel extending between said jet-array plate and said baseplate;   said jet-array plate defining a plurality of orifices extending therethrough to convey fluid from said supply header and into said main channel, with said orifices being configured to direct the fluid toward predetermined zones on said second surface of said baseplate;   wherein said baseplate extends in a generally flat plane, and wherein a central region of said baseplate defines a plurality of fins extending transverse to the generally flat plane of said baseplate and into said cooling passage; and   wherein said fins of said plurality of fins are formed in said baseplate by machining or by compressive force.   
     
     
         18 . A coldplate comprising:
 a baseplate of thermally-conductive material including a first surface and a second surface opposite said first surface, with said first surface configured to be in thermally-conductive communication with a plurality of heat sources;   a housing and said baseplate together defining a cooling passage for circulation of a cooling fluid to remove heat from said baseplate;   a jet-array plate disposed in said cooling passage and extending parallel to and spaced apart from said baseplate to subdivide said cooling passage into a supply header opposite said baseplate and a main channel extending between said jet-array plate and said baseplate;   said jet-array plate defining a plurality of orifices extending therethrough to convey fluid from said supply header and into said main channel, with said orifices being configured to direct the fluid toward predetermined zones on said second surface of said baseplate;   a second baseplate of thermally-conductive material including a first surface and a second surface opposite said first surface, with said first surface configured to be in thermally-conductive communication with a second plurality of heat sources;   a second jet-array plate disposed in said cooling passage and extending parallel to and spaced apart from said second baseplate to separate said supply header from a second main channel extending between said second jet-array plate and said second baseplate;   said second jet-array plate defining a plurality of second orifices extending therethrough to convey fluid from said supply header and into said second main channel, with said second orifices being configured to direct the fluid toward predetermined zones on said second surface of said second baseplate   
     
     
         19 . The coldplate of  claim 18 , wherein said second baseplate extends parallel to and spaced apart from said baseplate, with said supply header disposed therebetween. 
     
     
         20 . The coldplate of  claim 18 , wherein said second baseplate extends in a generally flat plane, and wherein a central region of said second baseplate defines a plurality of fins extending transverse to the generally flat plane of said second baseplate and into said cooling passage.