Apparatus for laying conductive pathways, method of laying conductive pathways and textile product comprising conductive pathways

Abstract

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink.

1 . An apparatus for laying conductive pathways on a tape to form a conductive tape, the apparatus comprising:
 a pair of surfaces arranged to apply a bonding pressure;   a first conductive pathway laying device configured to lay a first conductive pathway on the tape and configured to vary the lateral position of the first conductive pathway as the tape moves through the pair of surfaces; and   a second conductive pathway laying device configured to lay a second conductive pathway on the tape and configured to vary the lateral position of the second conductive pathway as the tape moves through the pair of surfaces, wherein the first conductive pathway laying device and/or the second conductive pathway laying device are configured to vary a lateral separation between the first conductive pathway and the second conductive pathway.   
     
     
         2 . An apparatus according to  claim 1 , wherein the first conductive pathway laying device comprises a first yarn position controller arranged to control the lateral position of a first conductive yarn on the tape when the bonding pressure is applied and the second conductive pathway laying device comprises a second yarn position controller arranged to control the lateral position of a second conductive yarn on the tape when the bonding pressure is applied. 
     
     
         3 . An apparatus according to  claim 2 , wherein the first and/or second yarn position controller comprises a nozzle. 
     
     
         4 . An apparatus according to  claim 1 , wherein the first and/or the second second conductive pathway laying device comprise a nozzle configured to lay a conductive ink on the tape. 
     
     
         5 . An apparatus according to  claim 1 , wherein the first conductive pathway laying device is configured to vary the lateral position of the first conductive pathway such that the first conductive pathway forms a first repeating pattern on the conductive tape and/or the second conductive pathway laying device is configured to vary the lateral position of the second conductive pathway such that the second conductive pathway forms a second repeating pattern on the conductive tape. 
     
     
         6 . An apparatus according to  claim 5 , wherein the first repeating pattern and/or the second repeating pattern is a repeating curved pattern or a triangle pattern. 
     
     
         7 . An apparatus according to  claim 6 , wherein the repeating curved pattern is a modified sinusoidal pattern. 
     
     
         8 . An apparatus according to  claim 7 , wherein the modified sinusoidal pattern is a sinusoidal pattern modified to maintain a tangential distance between the first conductive pathway and second conductive pathway above a minimum tangential distance. 
     
     
         9 . An apparatus according to  claim 1 , wherein at least one surface of the pair of surfaces is implemented as a roller or conveyer belt. 
     
     
         10 . An apparatus according to  claim 1 , wherein the first and/or second conductive pathway laying device comprises a linear guide. 
     
     
         11 . A method of manufacturing a conductive tape, the method comprising
 laying a first conductive pathway on a first tape layer;   laying a second conductive pathway on the first tap layer   bonding the first conductive pathway and the second conductive pathway to the first tape layer to form the conductive tape by applying a heat and/or bonding pressure at a bonding point;   moving the conductive tape relative to the bonding point in a longitudinal direction; and   varying the lateral position of the first conductive pathway at the bonding point as the conductive tape moves in the longitudinal direction so that the lateral position of the first conductive pathway within the conductive tape forms a repeating pattern and varying a lateral separation between the first conductive pathway and the second conductive pathway so that a tangential distance between the first conductive pathway and second conductive pathway is maintained above a minimum tangential distance.   
     
     
         12 . A method according to  claim 11 , comprising varying a lateral velocity of the first conductive pathway such that the lateral velocity is higher when the first conductive pathway is moving away from the second conductive pathway than when the first conductive pathway is moving towards the second conductive pathway. 
     
     
         13 . A method according to  claim 11 , comprising varying a pattern of the first and/or second conductive pathway between a first sinusoidal function and a second sinusoidal function, the second sinusoidal function having a greater curvature than the first sinusoidal function. 
     
     
         14 . A method according to  claim 11 , wherein laying the conductive pathway on the first tape layer comprises laying the conductive pathway between the first tape layer and a second tape layer. 
     
     
         15 . A method according to  claim 11 , wherein laying the first conductive pathway and/or laying the second conductive pathway on the first tape layer comprises positioning a conductive yarn on the first tape layer. 
     
     
         16 . A method according to  claim 11 , wherein laying the conductive pathway and/or laying the second conductive pathway on the first tape layer comprises applying a conductive ink to the first tape layer. 
     
     
         17 . A method according to  claim 16 , further comprising curing the conductive ink. 
     
     
         18 . A method of laying conductive yarn on a substrate, the method comprising
 laying a first conductive yarn by varying a lateral position of the first conductive yarn on the substrate to form a first repeating pattern; and   laying a second conductive yarn by varying a lateral position of the second conductive yarn on the substrate to form a second repeating pattern,   wherein the lateral separation of the first conductive yarn and the second conductive yarn varies to maintain a minimum tangential separation of the first conductive yarn and the second conductive yarn.   
     
     
         19 . A method of printing a conductive pathways on a substrate, the method comprising
 applying a first conductive pathway to the substrate by varying a lateral position of a first nozzle configured to apply conductive ink to the substrate to form a first repeating pattern; and   applying a second conductive pathway to the substrate by varying a lateral position of a second nozzle configured to apply conductive ink to the substrate to form a second repeating pattern,   wherein the lateral separation of the first nozzle and the second nozzle varies to maintain a minimum tangential separation of the first conductive pathway and the second conductive pathway.   
     
     
         20 . A method according to  claim 18 , wherein the substrate is a stretchable substrate.