US2022039961A1PendingUtilityA1

Implant components and methods

Assignee: SMITH & NEPHEW INCPriority: Jun 8, 2010Filed: Oct 25, 2021Published: Feb 10, 2022
Est. expiryJun 8, 2030(~3.9 yrs left)· nominal 20-yr term from priority
G06F 9/45533A61F 2002/3429A61F 2002/30449A61B 17/82A61F 2002/30579A61F 2002/30952A61F 2002/30011A61F 2/30907A61F 2002/30985A61F 2002/30331A61F 2/30734A61F 2002/30387A61F 2/30771A61F 2002/3096A61B 17/8685A61F 2002/3487A61F 2002/30507A61F 2002/30169A61F 2002/30604A61F 2002/4615A61F 2002/30462A61F 2002/30736A61F 2002/30578A61F 2002/30891A61F 2002/30474A61F 2002/30841A61F 2002/30471A61F 2/30749A61F 2/30942A61F 2002/3448A61F 2002/30538A61F 2002/3441A61F 2002/30617B33Y 80/00A61F 2002/3092A61F 2002/30326A61F 2/30965A61F 2/34A61F 2002/348A61B 17/8066A61B 17/866A61F 2002/3082A61F 2002/4619A61F 2/4609A61F 2002/30189A61F 2002/3412A61F 2002/3093
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Claims

Abstract

Systems, devices, and methods are provided for orthopedic implants. The implants may include a base member, such as an acetabular shell or an augment, that is configured to couple with an augment, flange cup, mounting member, or any other suitable orthopedic attachment. Mounting members include, for example, flanges, blades, hooks, and plates. In some embodiments, the orthopedic attachments may be adjustably positionable about the base member or other attachments, thereby providing modularity for assembling and implanting the device, and various securing and/or locking mechanisms may be used between the components of the implant.

Claims

exact text as granted — not AI-modified
1 . An implantable orthopedic device, comprising:
 an implant having a porous surface defining a plurality of pores sized to accommodate bone-ingrowth into the implant, the implant further including a plurality of protrusions extending from the porous surface and which rise above the porous surface;   wherein the plurality of protrusions are configured to frictionally engage a bone surface without interfering with bone ingrowth into the plurality of pores;   wherein the implant is a metallic implant; and   wherein the implant comprises a surface profile that is formed using a rapid manufacturing process.   
     
     
         2 . The device of  claim 1 , wherein the rapid manufacturing process comprises a 3D printing process. 
     
     
         3 . The device of  claim 1 , wherein the rapid manufacturing process comprises a selective laser sintering process. 
     
     
         4 . The device of  claim 1 , wherein the protrusions are blunt. 
     
     
         5 . The device of  claim 1 , wherein the protrusions rise above the porous surface to a height between about 50 μm and about 2,000 μm. 
     
     
         6 . The device of  claim 5 , wherein the height is between about 100 μm and about 1,100 μm. 
     
     
         7 . The device of  claim 1 , wherein the implant comprises a solid non-porous portion. 
     
     
         8 . The device of  claim 7 , wherein the solid non-porous portion of the implant comprises a solid outer surface portion. 
     
     
         9 . The device of  claim 8 , wherein the solid outer surface portion is configured for articulation with another implant component. 
     
     
         10 . The device of  claim 1 , wherein the protrusions occupy approximately 10% to approximately 60% of the porous surface. 
     
     
         11 . The device of  claim 1 , wherein the pores have a size of approximately 50 microns to 1000 microns. 
     
     
         12 . The device of  claim 1 , wherein the protrusions have a concentration between about 0.25 protrusions per square millimeter and about 6 protrusions per square millimeter. 
     
     
         13 . An implantable orthopedic device, comprising:
 an implant having a porous surface defining a plurality of pores sized to accommodate bone-ingrowth into the implant, the implant further including a plurality of protrusions extending from the porous surface and which rise above the porous surface; wherein the plurality of protrusions are configured to frictionally engage a bone surface without interfering with bone ingrowth into the plurality of pores;   wherein the implant comprises a surface profile that is formed using a rapid manufacturing process; and   wherein the protrusions rise above the porous surface to a height between about 50 μm and about 2,000 μm.   
     
     
         14 . The device of  claim 13 , wherein the protrusions are blunt. 
     
     
         15 . The device of  claim 13 , wherein the height is between about 100 μm and about 1,100 μm. 
     
     
         16 . The device of  claim 13 , wherein the implant comprises a solid non-porous portion. 
     
     
         17 . The device of  claim 16 , wherein the solid non-porous portion of the implant comprises a solid outer surface portion. 
     
     
         18 . The device of  claim 17 , wherein the solid outer surface portion is configured for articulation with another implant component. 
     
     
         19 . The device of  claim 13 , wherein the protrusions occupy approximately 10% to approximately 60% of the porous surface. 
     
     
         20 . The device of  claim 13 , wherein the pores have a size of approximately 50 microns to 1000 microns. 
     
     
         21 . The device of  claim 13 , wherein the protrusions have a concentration between about 0.25 protrusions per square millimeter and about 6 protrusions per square millimeter. 
     
     
         22 . An implantable orthopedic device, comprising:
 an implant having a porous surface defining a plurality of pores sized to accommodate bone-ingrowth into the implant, the implant further including a plurality of protrusions extending from the porous surface and which rise above the porous surface;   wherein the plurality of protrusions are configured to frictionally engage a bone surface without interfering with bone ingrowth into the plurality of pores;   wherein the protrusions rise above the porous surface to a height between about 50 μm and about 2,000 μm; and   wherein the implant comprises a surface profile that is formed using a selective laser sintering process

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