Electronic power system and method for manufacturing the same
Abstract
The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An electronic power system comprising at least one electronic power module, wherein the electronic power module comprises a base plate and at least one heat generating component arranged on a first side of the base plate, wherein the electronic power module comprises a cooling structure for transporting heat away from the electronic power module via a coolant that is guided by the cooling structure, wherein the cooling structure is arranged on a second side of the base plate opposite to the first side, wherein the cooling structure is integrally formed with the base plate, wherein the cooling structure comprises at least two wall structures, and wherein the wall structures are not contiguous.
2 . The electronic power system according to claim 1 , wherein at least one of the wall structures is for stiffening the base plate and directing a coolant along the cooling structure.
3 . The electronic power system according to claim 1 , wherein at least one of the wall structures comprises at least one stabilizing wall element, wherein the stabilizing wall element does not change direction for at least one third of the extension of the base plate along that direction.
4 . The electronic power system according to claim 3 , wherein the electronic power module comprises at least two stabilizing wall elements that are arranged at a relative angle between 60° and 120°.
5 . The electronic power system according to claim 3 , wherein the cooling structure is limited in the transversal plane by at least three stabilizing wall elements.
6 . The electronic power system according to claim 1 , wherein the wall structures form an interleaved comb pattern for guiding the flow of the coolant along the cooling structure and stabilizing the base plate.
7 . The electronic power system according to claim 2 , wherein the cooling structure further comprises transversally isolated pins, and wherein the transversally isolated pins are isolated from the wall structures.
8 . The electronic power system according to claim 3 , wherein the cooling structure comprises at least three wall structures each of which comprises at least one stabilizing wall element, wherein the at least three stabilizing wall elements extend radially towards a common center location.
9 . The electronic power system according to claim 1 , wherein the electronic power system comprises at least two electronic power modules and a common coolant distributor, wherein the common coolant distributor comprises at least one distributor inlet and at least one distributor outlet connected to each electronic power module.
10 . The electronic power system according to claim 9 , wherein the common coolant distributor comprises individual depressions for receiving each electronic power module, wherein each depression comprises at least one distributor inlet and at least one distributor outlet.
11 . A method for manufacturing an electronic power system comprising at least one electronic power module, wherein the electronic power module comprises a base plate and at least one heat generating component arranged on a first side of the base plate, wherein the electronic power module comprises a cooling structure for transporting heat away from the electronic power module via a coolant that is guided by the cooling structure, and wherein the cooling structure is arranged on a second side of the base plate opposite to the first side, comprising the steps:
providing a raw base plate, forming a cooling structure on the second side of the raw base plate such that the cooling structure is an integral part of the base plate, fixing the at least one heat generating component to the first side, wherein the cooling structure comprises at least two wall structures, and
wherein the wall structures are not contiguous.
12 . The method according to claim 11 , wherein the cooling structure is formed by cold forging the raw base plate.
13 . The electronic power system according to claim 2 , wherein at least one of the wall structures comprises at least one stabilizing wall element, wherein the stabilizing wall element does not change direction for at least one third of the extension of the base plate along that direction.
14 . The electronic power system according to claim 4 , wherein the cooling structure is limited in the transversal plane by at least three stabilizing wall elements.
15 . The electronic power system according to claim 2 , wherein the wall structures form an interleaved comb pattern for guiding the flow of the coolant along the cooling structure and stabilizing the base plate.
16 . The electronic power system according to claim 3 , wherein the wall structures form an interleaved comb pattern for guiding the flow of the coolant along the cooling structure and stabilizing the base plate.
17 . The electronic power system according to claim 4 , wherein the wall structures form an interleaved comb pattern for guiding the flow of the coolant along the cooling structure and stabilizing the base plate.
18 . The electronic power system according to claim 5 , wherein the wall structures form an interleaved comb pattern for guiding the flow of the coolant along the cooling structure and stabilizing the base plate.
19 . The electronic power system according to claim 3 , wherein the cooling structure further comprises transversally isolated pins, and wherein the transversally isolated pins are isolated from the wall structures.Join the waitlist — get patent alerts
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