Method for conveying high frequency module and a high-frequency module

Abstract

A method and a high-frequency module that includes a high frequency die that may include multiple die pads; a substrate that may include a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer; a line card that may include multiple line card pads; and multiple conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the multiple line card pads.

1 . A method for conveying high-frequency signals between a line card and a high frequency die of a high frequency module, the method comprises:
 outputting a first high frequency signal from a first die pad of the high frequency die; and   conveying the first high frequency signal through a first conductive path to a first line card pad of the line card; wherein the first conductive path passes through a substrate without reaching a majority of a depth of a core of the substrate.   
     
     
         2 . The method according to  claim 1  comprising: outputting a second high frequency signal from a second line card pad of the line card; and conveying the second high frequency signal through a second conductive path to a second die pad of the high frequency die; wherein the second conductive path passes through the substrate without reaching the majority of the depth of the core of the substrate. 
     
     
         3 . The method according to  claim 1  wherein the high frequency die comprises multiple die pads, the line card comprises multiple line card pads, and the high frequency module comprises multiple conductors that couple the multiple die pads to the multiple line card pads; wherein the multiple conductors pass through the substrate without reaching the majority of the depth of the core; wherein the multiple line card pads comprise the first line card pad; wherein the multiple die pads comprises the first die pad; and wherein the first conductive path comprises a first conductor that belongs to the multiple conductors. 
     
     
         4 . The method according to  claim 3  wherein the line card comprises an aperture that surrounds the high frequency die. 
     
     
         5 . The method according to  claim 4  comprising dissipating heat generated by the high frequency die by a heat sink that is connected to a top surface of the high frequency die and extends outside the aperture. 
     
     
         6 . The method according to  claim 5  wherein an area of the heat sink exceeds an area of the aperture. 
     
     
         7 . The method according to  claim 3  comprising dissipating heat generated by the high frequency die by a heat sink that is thermally coupled to the high frequency die. 
     
     
         8 . The method according to  claim 3  wherein the first conductive path comprises a first pin of a ball grid array that is positioned between the multiple line card pads and the multiple conductors. 
     
     
         9 . The method according to  claim 3  wherein the first conductive path comprises a first bump of bumps that are positioned between the multiple die pads and the multiple conductors. 
     
     
         10 . The method according to  claim 3  wherein the high frequency die is a high frequency optoelectronic die. 
     
     
         11 . The method according to  claim 3  wherein the high frequency it not lower than one hundred gigabits per second.