US2022085458A1PendingUtilityA1

Porous insulator, electrode, and nonaqueous power storage element

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Assignee: RICOH CO LTDPriority: Mar 15, 2018Filed: Nov 22, 2021Published: Mar 17, 2022
Est. expiryMar 15, 2038(~11.7 yrs left)· nominal 20-yr term from priority
H01M 50/491H01M 50/489H01M 50/417H01M 50/451H01M 50/423H01M 50/429H01M 10/4235H01M 50/46Y02E60/50H01M 50/426Y02P70/50H01M 4/131Y02E60/10H01M 4/86H01M 10/0525H01M 10/0585H01M 50/443H01M 4/13H01M 4/62Y02E10/542H01G 11/22H01G 11/52H01M 50/463H01M 50/411H01G 9/2027
73
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Claims

Abstract

A porous insulator contains a porous structure, containing a polymer compound having communicating pores, and a solid having a melting point or glass transition temperature lower than that of the polymer compound.

Claims

exact text as granted — not AI-modified
1 - 6 . (canceled) 
     
     
         7 : An ink comprising:
 a polymerizable compound;   a porogen capable of dissolving the polymerizable compound; and   a solid,   wherein, as a polymerization of the polymerizable compound progresses to produce a polymer, a phase of the porogen separates from a phase of the polymer,   wherein the solid has a lower melting point or glass transition temperature than the polymer.   
     
     
         8 : The ink of  claim 7 , wherein the polymerizable compound has two or more polymerizable groups. 
     
     
         9 : The ink of  claim 7 , wherein the polymerizable compound comprises at least one member selected from the group consisting of acrylate resins, methacylate resins, urethane acrylate resins, and vinyl ester resins. 
     
     
         10 : The ink of  claim 7 , wherein the ink has a viscosity of from 1 to 150 mPa·s at 25 degrees C. 
     
     
         11 : The ink of  claim 7 , wherein the ink has a viscosity of from 5 to 20 mPa·s at 25 degrees C. 
     
     
         12 : The ink of  claim 7 , wherein a proportion of the polymerizable compound in the ink is from 10% to 70% by mass. 
     
     
         13 : The ink of  claim 7 , wherein a proportion of the polymerizable compound in the ink is from 10% to 50% by mass. 
     
     
         14 : The ink of  claim 7 , wherein a volume ratio between the polymerizable compound and the solid is from 1:1 to 1:15. 
     
     
         15 : The ink of  claim 7 , wherein a volume ratio between the polymerizable compound and the solid is from 1:1 to 1:10. 
     
     
         16 : The ink of  claim 7 , further comprising a polymerization initiator comprising a photopolymerization initiator. 
     
     
         17 : The ink of  claim 7 , wherein the solid comprises a resin. 
     
     
         18 : A method for manufacturing a porous insulator, comprising:
 applying the ink of  claim 7  onto a substrate;   polymerizing the polymerizable compound; and   removing the porogen.   
     
     
         19 : The method of  claim 18 , wherein the polymerizing includes irradiating the polymerizable compound with non-ionizing radiation, ionizing radiation, or infrared rays. 
     
     
         20 : The method of  claim 18 , wherein the polymerization is performed under N 2  atmosphere. 
     
     
         21 : The method of slain wherein the substrate is an electrode substrate. 
     
     
         22 : The method of  claim 18 , wherein the substrate comprises an electrode substrate and an electrode mixture overlying the electrode substrate. 
     
     
         23 : The method of  claim 18 , wherein the porous insulator is formed by a polymerization induced phase separation method. 
     
     
         24 : The method of  claim 18 , wherein the applying is performed by inkjet printing. 
     
     
         25 : A porous insulator produced by the method of  claim 18 . 
     
     
         26 : An ink comprising:
 a polymerizable compound;   a porogen; and   a solid,   wherein, when the polymerizable compound is caused to polymerize by a polymerization induced phase separation method and the porogen is removed, a polymer is formed having a bicontinuous or monolith structure containing multiples pores communicated with each other,   wherein the solid has a lower melting point or glass transition temperature than the polymer.

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