Polishing pad conditioner and manufacturing method thereof

Abstract

The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.

What is claimed is: 
     
         1 . A polishing pad conditioner, comprising:
 a substrate;   an abrasive layer covering a surface of the substrate, wherein the abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer, each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated; and   a protective layer covering a surface of the bonding layer, wherein the protrusion is exposed outside the protective layer.   
     
     
         2 . The polishing pad conditioner of  claim 1 , wherein the protective layer is formed by an electrodeposition coating composition; wherein the electrodeposition coating composition includes a main resin, and the main resin is epoxy resin, acrylic resin, polybutadiene resin, polyester resin or polyamide resin. 
     
     
         3 . The polishing pad conditioner of  claim 1 , wherein the substrate is a metal substrate, a metal alloy substrate, a stainless steel substrate, or a mold steel substrate. 
     
     
         4 . The polishing pad conditioner of  claim 1 , wherein the bonding layer is made of brazing material, electroplating material, ceramic material, metal material or polymer material. 
     
     
         5 . The polishing pad conditioner of  claim 1 , wherein the abrasive particles are at least one abrasive particles selected from a group consisting of natural diamond, synthetic diamond, polycrystalline diamond, cubic boron nitride, aluminum oxide, and silicon carbide. 
     
     
         6 . The polishing pad conditioner of  claim 1 , which has a cutting rate (CR completed ), wherein the variation rate between the cutting rate (CR completed ) and the cutting rate (CR initial ) of a polishing pad conditioner that is not covered with a protective layer is less than 10%. 
     
     
         7 . A method for manufacturing a polishing pad conditioner, the steps of which include:
 (a) providing a substrate;   (b) forming an abrasive layer on a surface of the substrate, wherein the abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer, and each abrasive particle has a protrusion exposed above the bonding layer;   (c) subjecting the protrusions to an insulation treatment; and   (d) electrodepositing a protective layer on a surface of the bonding layer, and exposing the insulated protrusions outside the protective layer.   
     
     
         8 . The method of  claim 7 , wherein the insulation treatment includes physical insulation or chemical insulation. 
     
     
         9 . The method of  claim 8 , wherein the physical insulation includes sandblasting insulation or plasma insulation. 
     
     
         10 . The method of  claim 8 , wherein the chemical insulation includes etching insulation. 
     
     
         11 . The method of  claim 10 , wherein the etching insulation includes etching with a chemical solution, wherein the chemical solution includes at least one selected from a group consisting of nitric acid, aqua regia, hydrofluoric acid, sulfuric acid, hydrogen peroxide, perchloric acid, hydrochloric acid, ferric chloride, acetic acid, and ammonium cerium nitrate. 
     
     
         12 . The method of  claim 7 , wherein the bonding layer is formed by an electroplating method or a brazing method.