Thermosetting composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board

Abstract

A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A), and an inorganic filler that is surface-treated with a surface treatment agent having a polymerizable unsaturated bond as Component (B).

1 . A resin sheet comprising a dried product or semi-cured product of a thermosetting composition,
 the thermosetting composition comprising:
 an ethylene-propylene-diene copolymer as Component (A); and 
 an inorganic filler, as Component (B), which is surface-treated with a surface treatment agent having a polymerizable unsaturated bond. 
   
     
     
         2 . The resin sheet of  claim 1 , wherein
 the content of the inorganic filler as the Component (B) falls within a range from 30 parts by mass to 500 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         3 . The resin sheet of  claim 1 , wherein
 the thermosetting composition further comprising, as Component (C), an organic compound having a polymerizable unsaturated group.   
     
     
         4 . The resin sheet of  claim 3 , wherein
 the content of the organic compound as the Component (C) falls within a range from 1 part by mass to 100 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         5 . A sheet of metal foil with resin, comprising: a sheet of metal foil; and a resin layer laid on top of the sheet of metal foil,
 the resin layer including a dried product or semi-cured product of a thermosetting composition, the thermosetting composition comprising:
 an ethylene-propylene-diene copolymer as Component (A); and 
 an inorganic filler, as Component (B), which is surface-treated with a surface treatment agent having a polymerizable unsaturated bond. 
   
     
     
         6 . The sheet of metal foil with resin of  claim 5 , wherein
 the content of the inorganic filler as the Component (B) falls within a range from 30 parts by mass to 500 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         7 . The sheet of metal foil with resin of  claim 5 , wherein
 the thermosetting composition further comprising, as Component (C), an organic compound having a polymerizable unsaturated group.   
     
     
         8 . The sheet of metal foil with resin of  claim 7 , wherein
 the content of the organic compound as the Component (C) falls within a range from 1 part by mass to 100 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         9 . The sheet of metal foil with resin of  claim 5 , wherein
 the resin layer includes:
 a first resin layer stacked on the sheet of metal foil; and 
 a second resin layer stacked on the first resin layer, 
   the first resin layer contains at least one component selected from the group consisting of: a liquid crystal polymer; a polyimide; a polyamide imide; a fluorocarbon resin; and polyphenylene ether, and   the second resin layer includes a dried product or semi-cured product of the thermosetting composition.   
     
     
         10 . The sheet of metal foil with resin of  claim 9 , wherein
 the first resin layer has a thickness of 1 μm to 50 μm, and   the second resin layer has a thickness of 5 μm to 200 μm.   
     
     
         11 . A metal-clad laminate comprising: an insulating layer; and a sheet of metal foil,
 the insulating layer including a cured product of a thermosetting composition, the thermosetting composition comprising:
 an ethylene-propylene-diene copolymer as Component (A); and 
 an inorganic filler, as Component (B), which is surface-treated with a surface treatment agent having a polymerizable unsaturated bond. 
   
     
     
         12 . The metal-clad laminate of  claim 11 , wherein
 the content of the inorganic filler as the Component (B) falls within a range from 30 parts by mass to 500 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         13 . The metal-clad laminate of  claim 11 , wherein
 the thermosetting composition further comprising, as Component (C), an organic compound having a polymerizable unsaturated group.   
     
     
         14 . The metal-clad laminate of  claim 13 , wherein
 the content of the organic compound as the Component (C) falls within a range from 1 part by mass to 100 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         15 . A printed wiring board comprising: an insulating layer; and conductor wiring,
 the insulating layer including a cured product of the thermosetting composition, the thermosetting composition comprising:
 an ethylene-propylene-diene copolymer as Component (A); and 
 an inorganic filler, as Component (B), which is surface-treated with a surface treatment agent having a polymerizable unsaturated bond. 
   
     
     
         16 . The printed wiring board of  claim 15 , wherein
 the content of the inorganic filler as the Component (B) falls within a range from 30 parts by mass to 500 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).   
     
     
         17 . The printed wiring board of  claim 15 , wherein
 the thermosetting composition further comprising, as Component (C), an organic compound having a polymerizable unsaturated group.   
     
     
         18 . The printed wiring board of  claim 17 , wherein
 the content of the organic compound as the Component (C) falls within a range from 1 part by mass to 100 parts by mass relative to 100 parts by mass of the ethylene-propylene-diene copolymer as the Component (A).