US2022127744A1PendingUtilityA1

Methods and Compositions for Improved Adherence of Organic Coatings to Materials

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Assignee: LUMISHIELD TECH INCORPORATEDPriority: Feb 1, 2019Filed: Feb 3, 2020Published: Apr 28, 2022
Est. expiryFeb 1, 2039(~12.5 yrs left)· nominal 20-yr term from priority
Inventors:John D. WatkinsHunaid Nulwala
C25D 9/10C25D 9/00C25D 9/08
35
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Claims

Abstract

Methods and compositions for improving adhesion of an organic coating applied to a surface of a conductive substrate are provided. In aspects described, at least one reactive metal-based deposit is electrodeposited on a conductive substrate by pulse electrochemical reduction of a metal complex using a pulse scheme, wherein the metal complex is dissolved in a substantially aqueous medium.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method of improving adhesion of an organic coating applied to a surface of at least one conductive substrate, comprising:
 electrodepositing at least one reactive metal-based deposit on a conductive substrate by pulse electrochemical reduction of a metal complex using a pulse scheme, wherein the metal complex is dissolved in a substantially aqueous medium; and   applying an organic coating to a surface of the reactive metal-based deposit wherein less than about 1 mm scribe creep is detected up to about 250 hours after a salt spray exposure.   
     
     
         2 . The method of  claim 1 , wherein the pulse scheme comprises at least one individual pulse. 
     
     
         3 . The method of  claim 2 , wherein the pulse scheme further comprises a plurality of pulses. 
     
     
         4 . The method of  claim 3 , wherein a current density of the at least one individual pulse and the plurality of pulses is from about 5 to about 100 mA/cm 2 . 
     
     
         5 . The method of  claim 4 , wherein the current density of the at least one individual pulse and the plurality of pulses is from about 15 to 60 mA/cm 2 . 
     
     
         6 . The method of  claim 5 , wherein the current density of the at least one individual pulse and the plurality of pulses is from about 25 to 55 mA/cm 2 . 
     
     
         7 . The method of  claim 1 , wherein less than 1 mm of scribe creep is detected up to about 500 hours after a salt spray exposure. 
     
     
         8 . The method of  claim 1 , wherein less than 2 mm of scribe creep is detected up to about 1000 hours after a salt spray exposure. 
     
     
         9 . The method of  claim 1 , wherein the reactive metal-based deposit comprises a reactive metal selected from the group consisting of zirconium, aluminum, titanium, manganese, gallium, vanadium, and niobium. 
     
     
         10 . The method of  claim 9 , wherein the reactive metal is aluminum. 
     
     
         11 . The method of  claim 1 , wherein the organic coating is selected from one or more of epoxy, phenolic resin, polyurethane, polyester, and fluoropolymer of blends thereof. 
     
     
         12 . The method of  claim 1 , wherein the conductive substrate comprises a material selected from the group consisting of carbon, steel, iron, nickel, and conductive plastics. 
     
     
         13 . The method of  claim 12 , wherein the substrate comprises steel. 
     
     
         14 . The method of  claim 1 , wherein the metal complex comprises an electron withdrawing ligand. 
     
     
         15 . The method of  claim 14 , wherein the electron withdrawing ligand is selected from the group consisting of sulfonate ligands, sulfonimide ligands, sulfonamide ligands, carboxylate ligands; and β-diketonate ligands. 
     
     
         16 . The method of  claim 15 , wherein the sulfonate ligands comprise OSO 2 R 1 , wherein R 1  is halo, substituted or unsubstituted C 6 -C 18 -aryl, substituted or unsubstituted C 1 -C 6 -alkyl, or substituted or unsubstituted C 6 -C 18 -aryl-C 1 -C 6 -alkyl. 
     
     
         17 . The method of  claim 15 , wherein the sulfonimide ligands comprise N(SO 2 R 1 ) 2 , wherein R 1  is wherein R 1  is halo; substituted or unsubstituted C 6 -C 18 -aryl; substituted or unsubstituted Ci-C 6 -alkyl; and substituted or unsubstituted C 6 -C 18 -aryl-C 1 -C 6 -alkyl. 
     
     
         18 . The method of  claim 15 , wherein the carboxylate ligands include ligands of a formula R 1 C(0)0-, wherein R 1  is wherein R 1  is halo; substituted or unsubstituted C 6 -C 18 -aryl; substituted or unsubstituted C 1 -C 6 -alkyl; and substituted or unsubstituted C 6 -C 18 -aryl-C 1 -Ce-alkyl. 
     
     
         19 . The method of  claim 14 , wherein the electron withdrawing ligand is selected from the group consisting of: 
       
         
           
           
               
               
           
         
         where R 1  is selected from the group consisting of F or CF 3 . 
       
     
     
         20 . The method of  claim 1 , wherein the substrate is steel, the reactive metal-based deposit comprises aluminum oxide, and the organic coating is selected from one or more of polyurethane and epoxy. 
     
     
         21 . A method of improving adhesion of an organic coating applied to a surface of at least one conductive substrate, comprising:
 electrodepositing at least one reactive metal-based deposit on a substrate by pulse electrochemical reduction of a metal complex dissolved in a substantially aqueous medium, the pulse electrochemical reduction comprising a pulse scheme having at least one pulse, wherein the at least one pulse has a current density from about 5 to about 100 mA/cm 2 ; and   applying an organic coating to a surface of the reactive metal-based deposit.   
     
     
         22 . The method of  claim 21 , wherein the pulse scheme further comprises a plurality of pulses. 
     
     
         23 . A method of improving corrosion resistance of a conductive substrate, comprising:
 electrodepositing at least one reactive metal-based deposit on the conductive substrate by pulse electrochemical reduction of a metal complex using a pulse scheme, wherein the metal complex is dissolved in a substantially aqueous medium; and   applying an organic coating to a surface of the reactive metal-based deposit wherein less than about 1 mm scribe creep is detected up to about 250 hours after a salt spray exposure.   
     
     
         24 . The method of  claim 23 , wherein the pulse scheme comprises at least one individual pulse having a current density from about 5 to about 100 mA/cm 2 . 
     
     
         25 . The method of  claim 23 , wherein less than 1 mm of scribe creep is detected up to about 500 hours after a salt spray exposure. 
     
     
         26 . The method of  claim 23 , wherein less than 2 mm of scribe creep is detected up to about 1000 hours after a salt spray exposure. 
     
     
         27 . The method of  claim 23 , wherein the reactive metal-based deposit comprises a reactive metal selected from the group consisting of zirconium, aluminum, titanium, manganese, gallium, vanadium, and niobium. 
     
     
         28 . The method of  claim 27 , wherein the reactive metal is aluminum. 
     
     
         29 . The method of  claim 23 , wherein the organic coating is selected from one or more of epoxy, phenolic resin, polyurethane, polyester, and fluoropolymer of blends thereof. 
     
     
         30 . The method of  claim 23 , wherein the conductive substrate comprises a material selected from the group consisting of carbon, steel, iron, nickel, conductive plastics. 
     
     
         31 . The method of  claim 30 , wherein the substrate comprises steel. 
     
     
         32 . The method of  claim 23 , wherein the metal complex comprises an electron withdrawing ligand.

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