US2022136085A1PendingUtilityA1
Lead-free Cu-Zn alloy
Est. expiryOct 29, 2040(~14.3 yrs left)· nominal 20-yr term from priority
C22C 9/04C22F 1/08
49
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A lead-free Cu—Zn base alloy consisting of: 58-64 wt % Cu; 0.4-1.4 wt % Fe; 0.4-2.3 wt % Mn; 1.5-3.5 wt % Ni; 0.1-4.4 wt % Al; 0.5-1.8 wt % Si; as an alloy component that promotes chip breaking either 0.65-1.2 wt % Sn with up to 0.025 wt % P, or 0.03-0.1 wt % P with up to 0.25 wt % Sn; up to 0.1 wt % Pb; balance Zn together with unavoidable impurities, which are permitted up to 0.05 wt % per element, wherein the sum total of unavoidable impurities does not exceed 0.15 wt %; and wherein Cr is tolerated up to 0.035 wt %.
Claims
exact text as granted — not AI-modified1 . A lead-free Cu—Zn base alloy consisting of:
Cu: 58-64 wt %;
Fe: 0.4-1.4 wt %;
Mn: 0.4-2.3 wt %;
Ni: 1.5-3.5 wt %;
Al: 0.1-4.4 wt %;
Si: 0.5-1.8 wt %;
an alloy component that promotes chip breaking either:
Sn: 0.65-1.2 wt %, wherein P is involved up to 0.025 wt %, or
P: 0.03-0.1 wt %, wherein Sn involvement up to 0.25 wt % is tolerated;
Pb: up to 0.1 wt %;
balance Zn together with unavoidable impurities, which are permitted up to 0.05 wt % per element, wherein the sum total of unavoidable impurities does not exceed 0.15 wt %;
wherein Cr is tolerated up to 0.035 wt %.
2 . The Cu—Zn base alloy of claim 1 , containing:
Cu: 59.5-61 wt %;
Fe: 0.4-1.1 wt %;
Mn: 0.4-1.1 wt %;
Ni: 2.5-3.7 wt %;
Al: 3.3-4.2 wt %;
Si: 1.0-1.8 wt %.
3 . The Cu—Zn base alloy of claim 2 , containing:
Fe: 0.6-1.1 wt %;
Mn: 0.6-1.0 wt %;
Ni: 2.6-3.3 wt %;
Al: 3.5-4.1 wt %;
Si: 1.1-1.7 wt %.
4 . The Cu—Zn base alloy of claim 2 , wherein the alloy contains 0.03-0.1 wt % P and Sn is tolerated up to 0.25 wt %.
5 . The Cu—Zn base alloy of claim 4 , wherein the alloy contains 0.05-0.08 wt % P.
6 . The Cu—Zn base alloy of claim 2 , wherein the alloy contains 0.65-1.2 wt % Sn and P is tolerated up to 0.02 wt %.
7 . The Cu—Zn base alloy of claim 6 , wherein the alloy contains 0.7-1.1 wt % Sn.
8 . The Cu—Zn base alloy of claim 1 , containing:
Cu: 60-62.5 wt %;
Fe: 0.8-1.4 wt %;
Mn: 1.4-2.3 wt %;
Ni: 1.5-2.5 wt %;
Al: 0.1-0.7 wt %;
Si: 0.5-1.2 wt %.
9 . The Cu—Zn base alloy of claim 8 , containing:
Fe: 0.85-1.25 wt %;
Mn: 1.5-2.1 wt %;
Ni: 1.7-2.35 wt %;
Al: 0.2-0.5 wt %;
Si: 0.6-1.0 wt %.
10 . The Cu—Zn base alloy of claim 8 , wherein the alloy contains 0.03-0.1 wt % P and Sn is tolerated up to 0.25 wt %.
11 . The Cu—Zn base alloy of claim 10 , wherein the alloy contains 0.05-0.08 wt % P.
12 . The Cu—Zn base alloy of claim 8 , wherein the alloy contains 0.65-1.2 wt % Sn and P is tolerated up to 0.02 wt %.
13 . The Cu—Zn base alloy of claim 12 , wherein the alloy contains 0.7-1.1 wt % Sn.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.