Integrated circuit package with through void guard trace

Abstract

Apparatuses, systems and methods associated with over void signal trace design are disclosed herein. In embodiments, an integrated circuit (IC) package may include a first layer that has a void and a guard trace, wherein a first portion of the void is located on a first side of the guard trace and a second portion of the void is located on a second side of the guard trace. The IC package may further include a second layer located adjacent to the first layer, wherein the second layer has a signal trace that extends along the guard trace. Other embodiments may be described and/or claimed.

What is claimed is: 
     
         1 . An integrated circuit (IC) package, comprising:
 a first layer that has a void and a first trace, wherein a first portion of the void is located on a first side of the first trace and a second portion of the void is located on a second side of the first trace, and wherein the first trace has a width; and   a second layer located adjacent to the first layer, wherein the second layer has a second trace that extends along the first trace, and wherein the second trace has a width less than the width of the first trace.   
     
     
         2 . The IC package of  claim 1 , wherein the first portion of the void has a first widest width, and the second portion of the void has a second widest width greater than the first widest width. 
     
     
         3 . The IC package of  claim 1 , further comprising a dielectric material located between the first trace and second trace, wherein the dielectric material separates the second trace from the first trace. 
     
     
         4 . The IC package of  claim 1 , wherein the first trace is at least twice as wide as the second trace. 
     
     
         5 . The IC package of  claim 1 , wherein a width of the first trace is at least ten percent greater than a width of the second trace. 
     
     
         6 . The IC package of  claim 1 , wherein a width of the second trace is between 40 and 60 micrometers, and wherein a width of the first trace is between 80 and 120 micrometers. 
     
     
         7 . The IC package of  claim 6 , wherein a width of the void is greater than 200 micrometers. 
     
     
         8 . The IC package of  claim 1 , wherein the IC package further includes a ground plane of a type of conductive metal, and wherein the first trace is of the type of conductive metal. 
     
     
         9 . The IC package of  claim 8 , wherein the void is encircled by the ground plane. 
     
     
         10 . The IC package of  claim 1 , wherein the void is an adhesion void. 
     
     
         11 . The IC package of  claim 1 , wherein the second trace is to be utilized for transmission of a high-speed signal. 
     
     
         12 . A computer device, comprising:
 a circuit board; and   an integrated circuit (IC) package mounted to the circuit board, wherein the IC package includes:
 a first layer that has a void and a first trace, wherein a first portion of the void is located on a first side of the first trace and a second portion of the void is located on a second side of the first trace, and wherein the first trace has a width; and 
 a second layer located adjacent to the first layer, wherein the second layer has a second trace that extends along the first trace, and wherein the second trace has a width less than the width of the first trace. 
   
     
     
         13 . The computer device of  claim 12 , wherein the first portion of the void has a first widest width, and the second portion of the void has a second widest width greater than the first widest width. 
     
     
         14 . The computer device of  claim 12 , wherein the IC package further includes a dielectric material located between the first trace and second trace, and wherein the dielectric material isolates the second trace from the first trace. 
     
     
         15 . The computer device of  claim 12 , wherein the first trace is at least twice as wide as the second trace. 
     
     
         16 . The computer device of  claim 12 , wherein a width of the first trace is at least ten percent greater than a width of the second trace. 
     
     
         17 . The computer device of  claim 12 , wherein a width of the second trace is between 40 and 60 micrometers, and wherein a width of the first trace is between 80 and 120 micrometers. 
     
     
         18 . The computer device of  claim 17 , wherein a width of the void is greater than 200 micrometers. 
     
     
         19 . The computer device of  claim 12 , wherein the IC package further includes a ground plane of a type of conductive metal, and wherein the first trace is of the type of conductive metal. 
     
     
         20 . The computer device of  claim 19 , wherein the void is encircled by the ground plane. 
     
     
         21 . The computer device of  claim 12 , wherein the void is an adhesion void. 
     
     
         22 . The computer device of  claim 12 , wherein the second trace is to be utilized for transmission of a high-speed signal. 
     
     
         23 . A substrate for an integrated circuit package, comprising:
 a first layer that has a void and a first trace, wherein a first portion of the void is located on a first side of the first trace and a second portion of the void is located on a second side of the first trace, and wherein the first trace has a width; and   a second layer located adjacent to the first layer, wherein the second layer has a second trace that extends along the first trace, and wherein the second trace has a width less than the width of the first trace.   
     
     
         24 . The substrate of  claim 23 , wherein the first portion of the void has a first widest width, and the second portion of the void has a second widest width greater than the first widest width. 
     
     
         25 . The substrate of  claim 23 , further comprising a dielectric material located between the first trace and second trace, wherein the dielectric material separates the second trace from the first trace.