US2022162376A1PendingUtilityA1

Curable compositions, articles therefrom, and methods of making and using same

Assignee: 3M INNOVATIVE PROPERTIES COPriority: Mar 25, 2019Filed: Mar 25, 2019Published: May 26, 2022
Est. expiryMar 25, 2039(~12.7 yrs left)· nominal 20-yr term from priority
H01M 50/264H01M 50/209C08G 65/226C08G 59/182Y02E60/10C08K 2003/2227C08K 3/22C08K 7/18C08G 59/686C08K 5/5435C08K 5/544C08K 5/37C08K 3/013C08L 63/00C08K 9/06C08K 5/548C08G 59/245H01M 50/233C08G 59/66H01M 10/653C09J 163/00H01M 2220/20
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Claims

Abstract

A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.

Claims

exact text as granted — not AI-modified
1 . A curable composition comprising:
 a first part comprising an epoxy resin; and   a second part comprising a multifunctional, functional thiol containing compound; and   an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition   wherein the multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.   
     
     
         2 . (canceled) 
     
     
         3 . (canceled) 
     
     
         4 . (canceled) 
     
     
         5 . The curable composition of  claim 1 , wherein the epoxy resin comprises an internally flexible bisphenol epoxy resin. 
     
     
         6 . The curable composition of  claim 5 , wherein the internally flexible bisphenol epoxy resin is represented by the following formula: 
       
         
           
           
               
               
           
         
       
       where Ar is bisphenol A, bisphenol F, bisphenol Z, or a mixture thereof. 
     
     
         7 . The curable composition of  claim 1 , wherein the epoxy resin comprises a phosphonic acid group in the backbone thereof. 
     
     
         8 . (canceled) 
     
     
         9 . The curable composition according to  claim 1 , further comprising a silane coupling agent, wherein the silane coupling agent comprises an amine terminated silane coupling agent. 
     
     
         10 . The curable composition according to  claim 1 , further comprising a silane coupling agent, wherein the silane coupling agent comprises a mercaptan terminated silane coupling agent. 
     
     
         11 . The curable composition according to  claim 1 , further comprising a silane coupling agent, wherein the silane coupling agent comprises an epoxy terminated silane coupling agent. 
     
     
         12 . The curable composition according to  claim 1 , further comprising a catalyst. 
     
     
         13 . The curable composition according to  claim 12 , wherein the catalyst comprises a basic catalyst. 
     
     
         14 . The curable composition according to  claim 13 , wherein the basic catalyst is represented by one of the following formulas: 
       
         
           
           
               
               
           
         
       
     
     
         15 . The curable composition according to  claim 12 , wherein the catalyst comprises a Lewis acid catalyst. 
     
     
         16 . The curable composition according to  claim 15 , wherein the Lewis acid catalyst comprises calcium triflate, calcium nitrate, or a tin catalyst. 
     
     
         17 .- 25 . (canceled) 
     
     
         26 . The curable composition according to  claim 1 , wherein the inorganic filler present in an amount of at least 50 wt. %, based on the total weight of the curable composition. 
     
     
         27 . (canceled) 
     
     
         28 . The curable composition according to  claim 1 , wherein the inorganic filler comprises spherical alumina particles and semispherical alumina particles. 
     
     
         29 . The curable composition according to  claim 1 , wherein the inorganic filer comprises silane surface-treated particles. 
     
     
         30 . The curable composition according to  claim 1 , wherein the inorganic filler comprises ATH. 
     
     
         31 . (canceled) 
     
     
         32 . The article of  claim 31 , wherein the cured composition has a thickness between from 5 microns to 10000 microns. 
     
     
         33 . (canceled) 
     
     
         34 . The article of  claim 33 , wherein the substrate is a metal substrate. 
     
     
         35 . (canceled) 
     
     
         36 . A battery module comprising a plurality of battery cells connected to a first base plate by a first layer of the reaction product of the curable composition according to  claim 1 . 
     
     
         37 . A method of making a battery module comprising: applying a first layer of a curable composition according to  claim 1  to a first surface of a first base plate, attaching a plurality of battery cells to the first layer to connect the battery cells to the first base plate, and curing the curable composition.

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