Method for fabrication of copper-indium gallium oxide and chalcogenide thin films
Abstract
A composition of matter having a coated silicon substrate with multiple alternating layers of polydopamine and polyallylamine bound copper-indium-gallium oxide (CIGO) nanoparticles on the substrate. A related composition of matter having polyallylamine bound to CIGO nanoparticles to form PAH-coated CIGO nanoparticles. A related CIGO thin film made via conversion of layer-by-layer assembled CIGO nanoparticles and polyelectrolytes. CIGO nanoparticles are created via a flame-spray pyrolysis method using metal nitrate precursors, subsequently coated with polyallylamine (PAH), and dispersed in aqueous solution. Multilayer films are assembled by alternately dipping a substrate into a solution of either polydopamine or polystyrenesulfonate and then in the CIGO-PAH dispersion to fabricate CIGO films as thick as 1-2 microns.
Claims
exact text as granted — not AI-modifiedWhat is claimed as new and desired to be protected by Letters Patent of the United States is:
1 . A copper indium gallium oxide thin film made by the method comprising:
producing copper-indium-gallium oxide (CIGO) nanoparticles via flame spray pyrolysis; binding the CIGO nanoparticles to a polyamine and dispersing the polyamine-CIGO nanoparticles in an aqueous solution to form a polyamine-CIGO dispersion; making a polyanion solution; and dipping a substrate into the polyanion solution and then the polyamine-CIGO dispersion, wherein alternate dipping between the polyanion solution and the coated CIGO dispersion may be repeated multiple times to form a CIGO film.
2 . The copper indium gallium chalcogenide thin film of claim 1 , additionally comprising oxidizing the CIGO film.
3 . The copper indium gallium chalcogenide thin film of claim 1 , wherein the polyamine comprises polyallylamine (PAH).
4 . The copper indium gallium chalcogenide thin film of claim 1 , wherein the polyanion comprises polystyrenesulfonate (PSS) or polydopamine (PDA).
5 . The copper indium gallium chalcogenide thin film of claim 1 , wherein the substrate comprises silicon, quartz, or molybdenum.
6 . The copper indium gallium chalcogenide thin film of claim 5 , wherein the silicon or quartz substrate has a coating comprising N-(2-aminoethyl)-3-aminopropyltrimethoxysilane (EDA) and the molybdenum substrate remains uncoated or has a coating of polydopamine (PDA).Join the waitlist — get patent alerts
Track US2022190173A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.