Conductive support member for intravascular imaging device and associated devices, systems, and methods

Abstract

An intravascular imaging device is provided. In one embodiment, the intravascular imaging device includes a flexible elongate member sized and shaped for insertion into a vessel of a patient, the flexible elongate member having a proximal portion and a distal portion; an imaging assembly disposed at the distal portion of the flexible elongate member, the imaging assembly including: a flex circuit; a conductor extending along the flexible elongate member and in electrical communication with the flex circuit; and a support member around which the flex circuit is positioned, the support member including a conductive portion electrically coupled to the support member.

What is claimed is: 
     
         1 . An intravascular imaging device comprising:
 a flexible elongate member sized and shaped for insertion into a vessel of a patient, wherein the flexible elongate member comprises a proximal portion and a distal portion; and   an imaging assembly disposed at the distal portion of the flexible elongate member, wherein the imaging assembly comprises:
 a support member comprising a first conductive portion with a first end and a second end; 
 a flexible substrate comprising a second conductive portion, wherein the flexible substrate is wrapped around the support member such that the second conductive portion contacts the second end of the first conductive portion and establishes electrical communication with first conductive portion; and 
 a conductor extending along the flexible elongate member, wherein the conductor is in electrical communication with the first conductive portion at a location proximate to the first end of the first conductive portion such that an electrical signal is transmitted between the conductor and the flexible substrate via the first conductive portion and the second conductive portion. 
   
     
     
         2 . The device of  claim 1 ,
 wherein the support member comprises a proximal flange, and   wherein the proximal flange comprises the first conductive portion.   
     
     
         3 . The device of  claim 2 , wherein the first conductive portion is disposed on a surface of the proximal flange. 
     
     
         4 . The device of  claim 2 , wherein the first conductive portion is disposed within a wall of the proximal flange. 
     
     
         5 . The device of  claim 1 , wherein the first conductive portion extends through a channel formed in the support member. 
     
     
         6 . The device of  claim 1 , wherein the flexible substrate includes a first section comprising a plurality of transducers, a second section comprising a plurality of controllers, and a third section comprising a plurality of conductive traces facilitating communication between the plurality of the transducers and the plurality of controllers. 
     
     
         7 . The device of  claim 6 , wherein the first conductive portion is in electrical communication with at least one of the plurality of controllers. 
     
     
         8 . The device of  claim 1 ,
 wherein the imaging assembly further comprises a plurality of conductors,   wherein the support member includes a plurality of first conductive portions,   wherein each one of the plurality of conductors is in communication with a respective one of the plurality of first conductive portions.   
     
     
         9 . The device of  claim 8 ,
 wherein the plurality of conductors comprises four conductors and the plurality of first conductive portions comprises four conductive portions.   
     
     
         10 . The device of  claim 9 , wherein the plurality of first conductive portions are spaced around a circumference of the proximal flange. 
     
     
         11 . The device of  claim 9 , wherein the plurality of first conductive portions are adjacent to one another. 
     
     
         12 . The device of  claim 1 ,
 wherein the imaging assembly further comprises a conductive pad in electrical communication with the first conductive portion, and   wherein the conductor is in electrical communication with the conductive pad.   
     
     
         13 . The device of  claim 12 , wherein the conductor is soldered to the conductive pad.