Chemical-mechanical polishing pad with textured platen adhesive

Abstract

A chemical-mechanical polishing pad comprising a removable platen adhesive comprising a textured surface. A method of using the polishing pad to eliminate or reduce the occurrence of spot balding on the surface of the polishing pad.

We claim: 
     
         1 . A chemical-mechanical polishing pad comprising; a polishing pad comprising a polishing surface, a back surface opposite the polishing surface, a platen adhesive attached to the back surface, wherein the platen adhesive has a textured surface, and comprises a removable adhesive. 
     
     
         2 . The polishing pad of  claim 1 , wherein the textured surface of the platen adhesive comprises a microchannel texture having microchannels. 
     
     
         3 . The polishing pad of  claim 2 , wherein the microchannel texture comprises an XY pattern. 
     
     
         4 . The polishing pad of  claim 2 , wherein the microchannel texture is formed by geometric shapes. 
     
     
         5 . The polishing pad of  claim 1 , wherein the polishing pad is of unitary structure. 
     
     
         6 . The polishing pad of  claim 1 , wherein the polishing pad is a multilayer polishing pad. 
     
     
         7 . The polishing pad of  claim 6 , wherein the multilayer polishing pad comprises a polishing layer and at least one of the following, a backing layer and a subpad layer. 
     
     
         8 . The polishing pad of  claim 1 , wherein the polishing pad is a less rigid pad, defined as having a load of about 0.4 lbf or less at a 3 inch deflection using a 12″ long×5″ wide sample strip. 
     
     
         9 . The polishing pad of  claim 2 , wherein the microchannels have a channel depth from about 5 μm to about 250 μm. 
     
     
         10 . The polishing pad of  claim 9 , wherein the channel depth is from about 20 μtm to about 50 μm. 
     
     
         11 . The polishing pads of  claim 2 , wherein the microchannels have a channel pitch from about 0.1 mm to about 10 mm. 
     
     
         12 . The polishing pad of  claim 11 , wherein the channel pitch is from about 1 mm to 5 mm. 
     
     
         13 . A method of affixing a chemical-mechanical polishing pad to a platen surface comprising: (a) securing a platen adhesive layer having a textured surface to the polishing pad, (b) attaching the polishing pad to the platen surface by pressing the textured surface of the platen adhesive to the platen surface, wherein the textured surface of the platen adhesive allows air to escape and not being trapped between the platen surface and the polishing pad. 
     
     
         14 . (canceled)