Conductive Adhesive Sheet

Abstract

Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X≤Y≤100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region. When optional three unique regions including the optional region are viewed in plan view so that the distribution number Np in each region be 9 to 25, the ratio Ng/Np is 0.8 to 1.0, where Ng represents the distribution number of conductive particles present in two or more of the three regions.

1 . A conductive adhesive sheet comprising:
 a binder component; and   conductive particles,   wherein the conductive particles are distributively arranged each as a primary particle or an aggregate of primary particles,   wherein, with the assumption that all the conductive particles are regularly arranged; and   that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributively arranged conductive particles be 9 to 25, a condition: 1.5X≤Y≤100X is met, where X represents an average of equivalent circle diameters of the distributively arranged conductive particles; and Y represents a center-to-center distance between adjacent two of the distributively arranged conductive particles which are regularly arranged in the plan view,   wherein a ratio N/Np is 1.0 to 100.0, where N represents a number of the primary particles in the optional region,   wherein, when optional three unique regions including the optional region are viewed in plan view so that the distribution number Np in each region be 9 to 25, a ratio Ng/Np is 0.8 to 1.0, where Ng represents a distribution number of conductive particles present in two or more of the three regions, and   wherein the center-center-distance Y is 100 to 1000 μm.   
     
     
         2 . The conductive adhesive sheet according to  claim 1 , wherein the ratio N/Np is from 1.05 to 50.0. 
     
     
         3 . The conductive adhesive sheet according to  claim 1 , wherein the center-to-center distance Y has a coefficient of variation of 0.5 or less. 
     
     
         4 . The conductive adhesive sheet according to  claim 1 , wherein the conductive adhesive sheet comprises a thermosetting resin as the binder component. 
     
     
         5 . The conductive adhesive sheet according to  claim 1 , wherein the conductive adhesive sheet contains the conductive particles in a proportion of 10 to 60 mass percent of the totality, 100 mass percent, of the conductive adhesive sheet. 
     
     
         6 . The conductive adhesive sheet according to  claim 1 , wherein, at least in an area of the conductive adhesive sheet, a portion in which the conductive particles are distributively arranged has a large thickness as compared with a portion in which no conductive particle is distributively arranged. 
     
     
         7 . The conductive adhesive sheet according to  claim 1 , wherein the average X of the equivalent circle diameters is 2 to 120 μm. 
     
     
         8 . An electromagnetic shielding film comprising the conductive adhesive sheet according to  claim 1 . 
     
     
         9 . A ground connector comprising the conductive adhesive sheet according to  claim 1 .