Process for producing an optoelectronic component, optoelectronic component and protective layer

Abstract

Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.

1 . A process for producing an optoelectronic component, comprising:
 forming a first electrode and at least one contact section atop a carrier;   forming an optically functional layer structure atop the first electrode;   forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section;   applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer; and   forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.   
     
     
         2 . The process of  claim 1 ,
 wherein the substance for production of the encapsulation layer is a precursor.   
     
     
         3 . The process of  claim 1 ,
 wherein the material of the protective layer is repellent to at least two precursors.   
     
     
         4 . The process of  claim 2 ,
 wherein the encapsulation layer is formed by an atomic layer deposition process or of a molecular layer deposition process.   
     
     
         5 . The process of  claim 1 ,
 wherein the protective layer is applied in structured form in the subregion.   
     
     
         6 . The process of  claim 5 ,
 wherein the materials of the protective layer and of the contact section are such that the material of the protective layer accumulates exclusively in the contact section.   
     
     
         7 . The process of  claim 1 ,
 wherein the protective layer takes the form of a self-assembled monolayer.   
     
     
         8 . The process of  claim 1 ,
 wherein the protective layer is applied only to the subregion that is at least one subregion of the contact section that is not to be coated by the encapsulation layer.   
     
     
         9 . The process of  claim 1 ,
 wherein an entirety of the optoelectronic component is coated in an unstructured manner with the material of the protective layer,   wherein the protective layer only adheres in regions intended for that purpose such that the protective layer is applied in a structured manner.   
     
     
         10 . The process of  claim 1 ,
 wherein the protective layer is a self-assembled monolayer with hydrophobic end groups.   
     
     
         11 . The process of  claim 10 ,
 wherein the hydrophobic end groups of the protective layer prevent the substance for production of an encapsulation layer to be absorbed on the surface of the subregion that is at least one subregion of the contact section.   
     
     
         12 . The process of  claim 1 ,
 wherein the material of the protective layer comprises molecules having a head group and an anchor group, wherein the anchor group is covalently bonded to the head group.   
     
     
         13 . The process of  claim 12 ,
 wherein the anchor group is a functional portion of the molecule that is capable of being absorbed onto a surface of the subregion that is at least one subregion of the contact section.   
     
     
         14 . The process of  claim 12 ,
 wherein the head group is hydrophobic.   
     
     
         15 . The process of  claim 1 ,
 wherein the protective layer has water-repellent properties, and   wherein the water-repellent properties of the protective layer prevent the formation of the encapsulation layer on the subregion that is at least one subregion of the contact section.