Methods Of Manufacturing Flex Circuits With Mechanically Formed Conductive Traces

Abstract

A flexible circuit comprises a laminated substrate, a layer of a protective coating, and first and second components. The laminated substrate comprises a support layer and a conductive layer arranged on the support layer. The conductive layer includes conductive traces. Edges of the conductive traces taper outwardly and towards the support layer. The layer of the protective coating is deposited on the conductive traces. The first component is soldered at a first connection point on one of the conductive traces. The soldering sublimates the protective coating. The second component is connected to the conductive layer at a second connection point. The second connection point is free of the protective coating.

What is claimed is: 
     
         1 . A flexible circuit, comprising:
 a laminated substrate comprising:
 a support layer; and 
 a conductive layer arranged on the support layer, 
 wherein the conductive layer includes conductive traces, and 
 wherein edges of the conductive traces taper outwardly and towards the support layer; 
   a layer of a protective coating deposited on the conductive traces;   a first component soldered at a first connection point on one of the conductive traces, wherein the soldering sublimates the protective coating; and   a second component electrically connected to the conductive layer at a second connection point, wherein the second connection point is free of the protective coating.   
     
     
         2 . The flex circuit of  claim 1  further comprising:
 an adhesive layer disposed between the conductive layer and the support layer, 
 wherein the edges of the adhesive layer taper outwardly and towards the support layer, and 
 wherein the edges of the adhesive layer are aligned with the edges of the conductive traces. 
 
     
     
         3 . The flex circuit of  claim 1  wherein the support layer includes a material selected from a group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyimide (PI). 
     
     
         4 . The flex circuit of  claim 1  wherein the conductive layer includes aluminum. 
     
     
         5 . The flex circuit of  claim 1  wherein the second component includes a bus-bar made of aluminum. 
     
     
         6 . The flex circuit of  claim 1  wherein the second component includes a conductor made of a different material than the conductive layer. 
     
     
         7 . The flex circuit of  claim 1  further comprising a conformal coating covering the first component and the conductive traces. 
     
     
         8 . The flex circuit of  claim 1  further comprising a conformal coating covering the first component, the conductive traces, and the connection at the second connection point. 
     
     
         9 . The flex circuit of  claim 1  further comprising a cover layer arranged over the conductive traces, wherein the cover layer includes windows for components to connect to the conductive traces. 
     
     
         10 . The flex circuit of  claim 1  wherein the second component is connected to the conductive layer by a process other than soldering. 
     
     
         11 . The flex circuit of  claim 1  wherein the second component is connected to the conductive layer by welding.