Power Module Having Reduced Intrinsic Inductance
Abstract
The present invention relates to a power module (1) having reduced intrinsic inductance, comprising an at least partially electrically insulating layer (3) that has a first side (3a) on which a power electronics unit (2) is arranged and a second side (3b) which is opposite the first side (3a), a compensation layer (10) being arranged on the second side (3b), which compensation layer is electrically conductive and to which compensation layer an electric potential can be applied. The invention also relates to a method for producing a power module, preferably a power module as described above.
Claims
exact text as granted — not AI-modified1 . A power module having reduced intrinsic inductance, comprising:
an at least partially electrically insulating layer that has a first side on which a power electronics unit is arranged and a second side which is opposite the first side; and a compensation layer is arranged on the second side, which compensation layer is electrically conductive and to which compensation layer an electric potential can be applied.
2 . The power module according to claim 1 , wherein:
the power electronics unit substantially has a layer structure, the layer structure preferably comprising a layer selected from a group comprising silicon, silicon carbide and gallium nitrite.
3 . The power module according to claim 1 , wherein:
the insulating layer is at least substantially planar and preferably extends parallel to a layer of the power electronics unit.
4 . The power module according to any of claim 1 , wherein:
the compensation layer is electrically connected to an electric potential of the power electronics unit, preferably of a switch.
5 . The power module according to any of claim 1 , wherein:
the compensation layer is divided into a plurality of portions, these portions being electrically insulated from one another and it being possible for different electric potentials, preferably potentials with opposite polarity signs, to be applied to these portions.
6 . The power module according to claim 1 , further comprising:
a plurality of at least partially electrically insulating layers, each of these layers having, on a second side opposite the power electronics unit, a compensation layer which is electrically conductive and to which an electric potential can be applied.
7 . The power module according to claim 5 , wherein:
at least two of the plurality of portions of a compensation layer and/or of the plurality of compensation layers have a mutually different geometry.
8 . The power module according to claim 1 , wherein:
the compensation layer is thermally conductive and is thermally connected to a heat sink in order to dissipate heat from the power electronics unit.
9 . A method for producing a power module, comprising the steps of:
providing a power electronics unit comprising an at least partially electrically insulating layer which has a first side that faces the power electronics and an opposite second side that faces away from the power electronics, and depositing an electrically conductive compensation layer on the second side of the at least partially electrically insulating layer.
10 . The method according to claim 9 , wherein:
the compensation layer is electrically connected to a pole of a direct voltage source or, in the case of alternating voltage, to an outer conductor.Join the waitlist — get patent alerts
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