Housing

Abstract

Provided is a housing that effectively serves to block high-frequency electromagnetic waves in addition to low-frequency electromagnetic waves. A housing that houses an electronic or electric device includes at least one of a copper layer serving as a diamagnetic layer and a nickel layer serving as a ferromagnetic layer, stacked on each of front and back sides of an iron base member, and a bright tin layer further stacked thereon as an outermost layer.

1 . A housing that houses an electronic or electric device, comprising:
 a base member having front and back sides;   at least one of a diamagnetic layer and a ferromagnetic layer, stacked on each of the front and back sides of the base member; and   a bright tin layer stacked as an outermost layer on each of the front and back sides of the base member.   
     
     
         2 . The housing according to  claim 1 , wherein the base member is made of iron. 
     
     
         3 . The housing according to  claim 2 , wherein a copper layer is stacked as the diamagnetic layer on each of the front and back sides of the base member. 
     
     
         4 . The housing according to  claim 3 , wherein the base member has a thickness of 0.1 to 3 mm, and the copper layer has a thickness of 1 to 10 μm. 
     
     
         5 . The housing according to  claim 2 , wherein a nickel layer is stacked as the ferromagnetic layer on each of the front and back sides of the base member. 
     
     
         6 . The housing according to  claim 5 , wherein the base member has a thickness of 0.1 to 3 mm, and the nickel layer has a thickness of 1 to 10 μm. 
     
     
         7 . The housing according to  claim 1 , wherein the diamagnetic layer and the ferromagnetic layer are stacked on each of the front and back sides of the base member. 
     
     
         8 . The housing according to  claim 1 , wherein the diamagnetic layer is stacked on each of the front and back sides of the base member, the ferromagnetic layer is stacked on the diamagnetic layer, and another diamagnetic layer is stacked on the ferromagnetic layer. 
     
     
         9 . The housing according to  claim 1 , wherein the ferromagnetic layer is stacked on each of the front and back sides of the base member, the diamagnetic layer is stacked on the ferromagnetic layer, and another ferromagnetic layer is stacked on the diamagnetic layer. 
     
     
         10 . The housing according to  claim 1 , wherein the base member is made of resin. 
     
     
         11 . The housing according to  claim 1 , wherein the base member comprises: a base member body made of resin; and an iron layer formed on each of front and back sides of the base member body. 
     
     
         12 . The housing according to  claim 1 , wherein the diamagnetic layer is a copper layer, a tin layer, or a carbon layer, and the ferromagnetic layer is an iron layer, a nickel layer, or a cobalt layer. 
     
     
         13 . A housing that houses an electronic or electric device, comprising:
 a base member made of resin, wax, or nonferrous metal and having front and back sides;   at least one of an iron layer and a nickel layer, stacked on each of the front and back sides of the base member;   a copper layer stacked on each of the front and back sides of the base member; and   a bright tin layer stacked as an outermost layer on each of the front and back sides of the base member.   
     
     
         14 . A housing that houses an electronic or electric device, comprising an iron layer, a copper layer, and a bright tin layer stacked together.