Spinal Implant With Fluid Delivery Capabilities

Abstract

A spinal implant that allows for fluid injection of material is disclosed. The implant includes a fitting with a passage and holes that are in fluid communication with the passage. The holes extend through upper and lower surfaces and/or into a central cavity of the implant. The implant allows for material to be introduced into the implant after initial implantation thereof. Methods of implanting the implant are also disclosed.

1 . A method of inserting a spinal implant into an intervertebral space, the method comprising the steps of:
 coupling a distal end of an insertion tool to an implant opening of a spinal implant to secure the spinal implant to the insertion tool, the implant opening being located between upper and lower surfaces of the spinal implant;   placing the spinal implant in an intervertebral space between first and second vertebral bodies such that the upper surface of the spinal implant adjacent the first vertebral body and the lower surface of the spinal implant is adjacent the second vertebral body;   introducing a material through a tool opening at a proximal end of the insertion tool, and   pushing the material through a passage of the insertion tool and along at least one internal channel of the spinal implant to contact the first vertebral body at the upper surface and the second vertebral body at the lower surface.   
     
     
         2 . The method of  claim 1 , further including a step of decoupling the insertion tool from the spinal implant after pushing the material through the passage of the insertion tool. 
     
     
         3 . The method of  claim 1 , wherein the material includes any of a cement, a bone growth promoting substance, BMA, biologics, antimicrobials, and antibiotics. 
     
     
         4 . The method of  claim 1 , wherein the step of pushing the material through the passage includes pushing the material to contact the first vertebral body through a first exit at the upper surface of the spinal implant and pushing the material to contact the second vertebral body through a second exit at the lower surface of the spinal implant along the internal channel. 
     
     
         5 . The method of  claim 4 , wherein the step of pushing the material through the passage includes pushing the material through a third exit of the spinal implant in fluid communication with a cavity formed though the upper and lower surfaces of the spinal implant. 
     
     
         6 . The method of  claim 5 , wherein the step of pushing the material through the first opening on the upper surface of the spinal implant incudes pushing the material to contact the first vertebral body through a plurality of first exits on the upper surface, and the step of pushing the material through the second opening includes pushing the material to the contact the second vertebral through a plurality of second exits. 
     
     
         7 . The method of  claim 6 , wherein the step of pushing the material through the third exit, includes pushing the material into the cavity through a plurality of third exits in fluid communication with the cavity. 
     
     
         8 . The method of  claim 7 , wherein the step of pushing the material through the passage includes pushing the material through a manifold in fluid communication with the internal channel, the manifold being disposed within the spinal implant. 
     
     
         9 . The method of  claim 1 , wherein the step of coupling the distal end of the insertion tool to the implant opening of the spinal implant, includes attaching a first luer fitting of the insertion tool to second luer fitting of the spinal implant to secure the spinal implant to the insertion tool, the first luer fitting being disposed on the distal end of the insertion tool and the second luer fitting being disposed in the implant opening of the spinal implant. 
     
     
         10 . The method of  claim 1 , wherein the upper and lower surfaces of the spinal implant are porous. 
     
     
         11 . A method of inserting a spinal implant into an intervertebral space, the method comprising the steps of:
 coupling a distal end of an insertion tool to an implant opening of a spinal implant to secure the spinal implant to the insertion tool, the implant opening being located between upper and lower surfaces of the spinal implant;   placing the spinal implant in an intervertebral space between first and second vertebral bodies such that the upper surface of the spinal implant is adjacent the first vertebral body and the lower surface of the spinal implant is adjacent the second vertebral body;   delivering a material to a manifold of the spinal implant through a passage of the insertion tool, the manifold being disposed within the spinal implant, and   pushing the material through at least one internal channel of the spinal implant to contact the first vertebral body at the upper surface and the second vertebral body at the lower surface, the internal channel being in communication with the manifold.   
     
     
         12 . The method of  claim 11 , wherein the material includes any of a cement, a bone growth promoting substance, BMA, biologics, antimicrobials, and antibiotics. 
     
     
         13 . The method of  claim 11 , wherein the step of pushing the material through at least one internal channel of the spinal implant includes, pushing the material to contact the first vertebral body through a first exit at the upper surface of the spinal implant and pushing the material to contact the second vertebral body through a second exit at the lower surface of the spinal implant along the internal channel. 
     
     
         14 . The method of  claim 13 , wherein the step of pushing the material to contact the first vertebral body includes the step of pushing the material through a first channel of the spinal implant, the first channel being in fluid communication with the first exit and the manifold. 
     
     
         15 . The method of  claim 14 , wherein the step of pushing the material to contact the second vertebral body includes the step of pushing the material through a second channel of the spinal implant, the second channel being in fluid communication with the second opening and the manifold. 
     
     
         16 . The method of  claim 15 , wherein the step of pushing the material through the at least one internal channel of the spinal implant includes pushing the material through a third exit in fluid communication with a cavity formed though the upper and lower surfaces of the spinal implant. 
     
     
         17 . The method of  claim 11 , wherein the step of coupling the distal end of the insertion tool to the implant opening of the spinal implant, includes attaching a first luer fitting of the insertion tool to a second luer fitting of the spinal implant to secure the spinal implant to the insertion tool, the first luer fitting being disposed on the distal end of the insertion tool and the second luer fitting being disposed in the implant opening of the spinal implant. 
     
     
         18 . The method of  claim 11 , wherein the upper and lower surfaces of the spinal implant are porous. 
     
     
         19 . A method of inserting a spinal implant into an intervertebral space, the method comprising the steps of:
 coupling a distal end of an insertion tool to an implant opening of a spinal implant to secure the spinal implant to the insertion tool, the implant opening being located between upper and lower surfaces of the spinal implant;   placing the spinal implant in an intervertebral space between first and second vertebral bodies such that the upper surface of the spinal implant is adjacent the first vertebral body and the lower surface of the spinal implant is adjacent the second vertebral body;   introducing a material through a tool opening at a proximal end of the insertion tool, and   delivering the material through a passage of the insertion tool and along a first channel of the spinal implant to contact the first vertebral body at the upper surface and along a second channel of the spinal implant to contact the second vertebral body at the lower surface.   
     
     
         20 . The method of  claim 19 , wherein the upper and lower surfaces of the spinal implant are porous.