Lamellar particles with functional coating

Abstract

There is disclosed a functional lamellar particle including an unconverted portion of the lamellar particle, wherein the unconverted portion includes a first metal, a converted portion of the lamellar particle disposed external to a surface of the unconverted portion, wherein the converted portion includes a chemical compound of the first metal; and a functional coating disposed external to a surface of the converted portion.

1 .- 19 . (canceled) 
     
     
         20 . A method, comprising: chemically converting a first material of a lamellar particle into a compound of the first material; and coating the compound of the first material with a functional coating. 
     
     
         21 . The method of  claim 20 , wherein the first material is a metal. 
     
     
         22 . The method of  claim 20 , wherein prior to the chemical conversion, the lamellar has an aspect ratio at least 2:1. 
     
     
         23 . The method of  claim 20 , wherein the functional coating can be a layer of a metal oxide; a metal; a taggant; a surfactant; a steric stabilizer; ormosil; organic compounds; polymer; dyes; UV absorbers; antioxidants; heat treatments; and combinations thereof. 
     
     
         24 . The method of  claim 20 , wherein the functional coating is applied by a process chosen from a sol-gel, a tumbling bed, incorporation into a polymer, molecular boding, electroless plating, electrolytic plating, chemical vapor deposition, sputtering, vacuum evaporation, and a chemical bath. 
     
     
         25 . The method of  claim 20 , wherein the chemical conversion is performed by a reactant and the reactant is in a form of at least one of solid state, liquid state, vapor state, and plasma state. 
     
     
         26 . The method of  claim 25 , wherein the liquid state is a chemical bath. 
     
     
         27 . The method of  claim 26 , wherein the chemical bath comprises water and a solvent. 
     
     
         28 . The method of  claim 26 , wherein the chemical bath comprises at least one of an inorganic compound, and an organic compound. 
     
     
         29 . The method of  claim 28 , wherein the inorganic compound comprises at least one of sulfur, sulfides, sulfates, oxides, hydroxides, isocyanates, thiocyanates, molybdates, chromates, permanganates, carbonates, thiosulfates, and inorganic salts. 
     
     
         30 . The method of  claim 28 , wherein the organic compound comprises at least one of organic compound containing sulfur, nitrogen, oxygen, and combinations thereof. 
     
     
         31 . The method of  claim 30 , wherein the organic compound comprises at least one of thiols, amines, thioamines, oxythio amines, thiourea, isocyanates, thiocyanates, and silanes. 
     
     
         32 . The method of  claim 26 , wherein the chemical bath comprises at least one of inorganic and organic salts of metals or metalorganic compounds of metals. 
     
     
         33 . The method of  claim 26 , wherein the chemical bath comprises an oxidizing agent. 
     
     
         34 . The method of  claim 26 , wherein the chemical bath comprises at least one of a surface modifier and inhibitors. 
     
     
         35 . The method of  claim 25 , wherein the solid state is a tumbling bed of pre-flakes. 
     
     
         36 . The method of  claim 25 , wherein the vapor state is a fluidized bed. 
     
     
         37 . The method of  claim 25 , wherein the reactant is introduced in the form of ionized gas, or is introduced into a plasma ignited in a carrier gas, or introduced oxidation through heat. 
     
     
         38 . The method of  claim 20 , wherein the lamellar particle comprises a first material and a second material at least partially encapsulating the first material. 
     
     
         39 . The method of  claim 38 , wherein the second material and the first material are different. 
     
     
         40 . The method of  claim 38 , wherein the second material is deposited on the first material by at least one of metal plating processes, roll-to-roll metallization processes, chemical bath deposition, physical vapor deposition, and chemical vapor deposition. 
     
     
         41 . The method of  claim 38 , further comprises depositing an internal layer between at least a portion of the second material and the first material. 
     
     
         42 . The method of  claim 41 , wherein the internal layer is deposited by one of sol-gel, chemical bath deposition, plating, physical vapor deposition, and chemical vapor deposition.