Dual Interface Metal Cards And Methods Of Manufacturing

Abstract

(i) Smartcards (SC) manufactured from a web of metal inlays (MI; FIGS. 12-14) with the coupling frame (CF) forming the metal card body (MCB) supported by metal struts (struts). In the production of smartcards having a coupling frame (CF) with a slit (S), the slit may form part of graphic elements (FIGS. 10-12). (ii) Printing and coating techniques may be used to camouflage the slit (FIGS. 9A-9D). (iii) Surface currents may be collected from one location in a card body (CB) and transported to another location (FIG. 15AB). A flexible circuit (FC) may be connected to termination points (TP) across the slit (S), or may couple via a patch antenna (PA) with the slit (S). The flexible circuit may couple, via an antenna structure (AS) with the module antenna (MA) of a transponder chip module (TCM).

What is claimed is: 
     
         1 . A smartcard (SC) comprising:
 a first, front face metal layer (ML) with a module opening (MO) and slit (S);   a primer layer disposed on a front surface of the front face metal layer;   a first ink layer disposed on the primer layer;   a protective varnish layer;   dielectric layer with adhesive disposed on a rear surface of the first metal layer;   a second, supporting metal layer (ML) with a module opening (MO) and slit (S) disposed below the dielectric layer;   an adhesive layer disposed below the second metal layer;   a synthetic layer with artwork disposed below the adhesive layer; and   a laser-engravable overlay with a magnetic stripe and a signature panel disposed below the synthetic layer.   
     
     
         2 . The smartcard of  claim 1 , further comprising:
 a concealing ink layer disposed between the primer layer and the first ink layer.   
     
     
         3 . The smartcard of  claim 2 , wherein:
 the first ink layer and concealing ink layer are interchanged with one another, so that the first ink layer is disposed on the primer layer and the concealing ink layer is disposed on the first ink layer.   
     
     
         4 . The smartcard of  claim 1 , further comprising:
 a second ink layer disposed on the first ink layer; and   
       the protective varnish layer is disposed on the second ink layer. 
     
     
         5 . The smartcard of  claim 4 , wherein:
 the second ink layer and the protective varnish layer are interchanged with one another, so that the protective varnish layer is disposed on the first ink layer and the second ink layer is disposed on the protective varnish layer.   
     
     
         6 . The smartcard of  claim 1 , further comprising:
 a personalization/laser engraving layer disposed on the protective varnish layer.   
     
     
         7 . The smartcard of  claim 1 , further comprising:
 a coating filling the slit.   
     
     
         8 . A smartcard (SC) comprising:
 a metal layer (ML) with a module opening (MO) and a slit (S);   a primer layer over the metal layer;   a coating or sealant over the primer layer;   an ink layer over the coating or sealant; and   a laser engravable top coat layer over the ink layer.   
     
     
         9 . The smartcard (SC) of  claim 8 , wherein:
 the primer, coating or sealant, ink, and top coat layers are all baked onto the metal layer.   
     
     
         10 . The smartcard (SC) of  claim 8 , wherein:
 each of the primer layer, coating or sealant, baked-on ink layer, and top coat layer also have a module opening extending therethrough.   
     
     
         11 . A smartcard (SC) comprising:
 a front card body (FCB) comprising an anodized metal layer (ML) with a slit (S).   
     
     
         12 . The smartcard (SC) of  claim 11 , further comprising:
 contact pads (CP) protruding through the metal layer.   
     
     
         13 . The smartcard (SC) of  claim 11 , further comprising:
 a rear card body (RCB) with a coupling loop structure (CLS) for coupling with the slit and with a module antenna (MA) of a transponder chip module (TCM).   
     
     
         14 . The smartcard (SC) of  claim 13 , wherein:
 the coupling loop structure (CLS) comprises a flexible circuit (FC).   
     
     
         15 . The smartcard (SC) of  claim 13 , wherein:
 the rear card body fits into a recess in a rear surface of the front card body.   
     
     
         16 . The smartcard (SC) of  claim 11 , wherein:
 the metal layer comprises one or more alloying elements from the group consisting of: copper, magnesium, manganese, silicon, tin and zinc, and combinations thereof.