Mopping mechanism and cleaning device

Abstract

A mopping mechanism is provided. The mopping mechanism includes at least one mopping plate movably mountable to a bottom surface of a cleaning device. The mopping mechanism also includes a magnetic element assembly including a primary magnetic element and a secondary magnetic element, and configured to generate a variable magnetic field to drive the at least one mopping plate to move reciprocatively relative to the bottom surface.

What is claimed is: 
     
         1 . A mopping mechanism, comprising:
 at least one mopping plate movably mountable to a bottom surface of a cleaning device; and   a magnetic element assembly including a primary magnetic element and a secondary magnetic element, and configured to generate a variable magnetic field to drive the at least one mopping plate to move reciprocatively relative to the bottom surface.   
     
     
         2 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a single mopping plate,   one of the primary magnetic element and the secondary magnetic element is disposed at the bottom surface within an opening provided in the single mopping plate, and   the other one of the primary magnetic element and the secondary magnetic element is disposed at the single mopping plate adjacent the opening.   
     
     
         3 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate,   the primary magnetic element is disposed at the first mopping plate, and   the secondary magnetic element is disposed at the second mopping plate facing the primary magnetic element.   
     
     
         4 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate,   the primary magnetic element is disposed at the bottom surface between the first mopping plate and the second mopping plate, and   the secondary magnetic element includes a first secondary magnetic element disposed at the first mopping plate facing the primary magnetic element, and a second secondary magnetic element disposed at the second mopping plate facing the primary magnetic element.   
     
     
         5 . The mopping mechanism of  claim 1 , wherein at least one of the primary magnetic element or the secondary magnetic element is an electromagnetic element or a permanent magnetic element. 
     
     
         6 . The mopping mechanism of  claim 1 , further comprising:
 a controller configured to control the magnetic element assembly to generate the varying magnetic field.   
     
     
         7 . The mopping mechanism of  claim 6 , further comprising:
 an electric motor configured to rotate at least one of the primary magnetic element or the secondary magnetic element,   wherein the controller is configured to control the electric motor to rotate at least one of the primary magnetic element or the secondary magnetic element to change the magnetic field.   
     
     
         8 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate, and   the mopping mechanism further includes a restoration component disposed between the first mopping plate and the second mopping plate, and configured to provide a restoration force on the first mopping plate and the second mopping plate.   
     
     
         9 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate,   the primary magnetic element is an electromagnetic element disposed at the first mopping plate, and   the secondary magnetic element is a linkage-shaped magnetic element including a first end disposed at the second mopping plate and a second end coupled with the primary magnetic element.   
     
     
         10 . The mopping mechanism of  claim 9 , further comprising a restoration component disposed between the first mopping plate and the second mopping plate, or disposed on the linkage-shaped magnetic element. 
     
     
         11 . The mopping mechanism of  claim 1 , wherein
 the primary magnetic element and the secondary magnetic element are electromagnetic elements, and   the mopping mechanism further includes a restoration component disposed between the first mopping plate and the second mopping plate.   
     
     
         12 . The mopping mechanism of  claim 1 , further comprising a position limiting element coupled with the primary magnetic element and the secondary magnetic element, and configured to maintain a minimum distance between the primary magnetic element and the secondary magnetic element. 
     
     
         13 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate further includes a first mopping plate and a second mopping plate, and   the mopping mechanism further includes:
 a restoration component disposed between the first mopping plate and the second mopping plate; and 
 a position limiting element coupled with the primary magnetic element and the secondary magnetic element and configured to maintain a minimum distance between the primary magnetic element and the secondary magnetic element. 
   
     
     
         14 . The mopping mechanism of  claim 1 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate,   the secondary magnetic element includes a first secondary magnetic element disposed at the first mopping plate and a second secondary magnetic element disposed at the second mopping plate, and   the mopping mechanism further includes a controller configured to change magnetic poles of the primary magnetic element facing the first secondary magnetic element and the second secondary magnetic element to provide the varying magnetic field to drive the first mopping plate and the second mopping plate to move in an opposite direction or in a same direction.   
     
     
         15 . A mobile device, comprising:
 at least one driving device configured to move the mobile device;   a bottom surface; and   a mopping mechanism disposed at the bottom surface, the mopping mechanism including:
 at least one mopping plate movably mounted to the bottom surface; and 
 a magnetic element assembly including a primary magnetic element and a secondary magnetic element, and configured to generate a variable magnetic field to drive the at least one mopping plate to move reciprocatively relative to the bottom surface. 
   
     
     
         16 . The mobile device of  claim 15 , wherein
 the at least one mopping plate includes a single mopping plate,   one of the primary magnetic element and the secondary magnetic element is disposed at the bottom surface within an opening provided in the single mopping plate, and   the other one of the primary magnetic element and the secondary magnetic element is disposed at the single mopping plate adjacent the opening.   
     
     
         17 . The mobile device of  claim 15 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate,   the primary magnetic element is disposed at the first mopping plate, and   the secondary magnetic element is disposed at the second mopping plate facing the primary magnetic element.   
     
     
         18 . The mobile device of  claim 15 , wherein
 the at least one mopping plate includes a first mopping plate and a second mopping plate, and   the mopping mechanism further includes a restoration component disposed between the first mopping plate and the second mopping plate, and configured to provide a restoration force on the first mopping plate and the second mopping plate.   
     
     
         19 . The mobile device of  claim 15 , wherein
 the primary magnetic element and the secondary magnetic element are electromagnetic elements, and   the mopping mechanism further includes a restoration component disposed between the first mopping plate and the second mopping plate.   
     
     
         20 . The mobile device of  claim 15 , further comprising a position limiting element coupled with the primary magnetic element and the secondary magnetic element, and configured to maintain a minimum distance between the primary magnetic element and the secondary magnetic element.