Method for suppressing increase in zinc concentration of plating solution and method for manufacturing zinc-based plating member

Abstract

Provided is a method for suppressing an increase in the zinc concentration of a plating solution when a zinc alloy plating member using nickel as an alloy element is manufactured using a zinc alloy plating apparatus. The plating apparatus includes: a plating tank; a first diaphragm tank having a first diaphragm; a cathode holding member; a first anode holding member; a soluble zinc-containing member held by the first anode holding member; a soluble metal-containing member containing the nickel which is the alloy element; and a second anode holding member for anode-electrolyzing the soluble metal-containing member. The first diaphragm tank is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and the plating solution is in contact with the other surface of the first diaphragm during use.

1 . A method for suppressing an increase in the zinc concentration of a plating solution when a zinc alloy plating member using nickel as an alloy element is manufactured using a zinc alloy plating apparatus, wherein
 the plating apparatus comprises:   a plating tank capable of accommodating the plating solution which is acidic;   a first diaphragm tank which is capable of accommodating the first electrolytic solution and has a first diaphragm composed of a cation exchange membrane;   a cathode holding member for cathode-electrolyzing a member to be plated that is in contact with the plating solution inside the plating tank during use;   a first anode holding member for anode-electrolyzing a soluble zinc-containing member that is in contact with the first electrolytic solution inside the first diaphragm tank during use;   the soluble zinc-containing member held by the first anode holding member;   a soluble metal-containing member containing the nickel which is the alloying element; and   a second anode holding member for anode-electrolyzing the soluble metal-containing member,   wherein the first diaphragm tank is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and the plating solution is in contact with the other surface of the first diaphragm during use.   
     
     
         2 . The method for suppressing an increase in the zinc concentration of a plating solution according to  claim 1 , wherein the second anode holding member is arranged in a manner that the soluble metal-containing member is in contact with the plating solution during use. 
     
     
         3 . The method for suppressing an increase in the zinc concentration of a plating solution according to  claim 1 , further comprising a second diaphragm tank which is capable of accommodating a second electrolytic solution and has a second diaphragm composed of a cation exchange membrane, wherein the second diaphragm tank is arranged in a manner that the second electrolytic solution which is in contact with the soluble metal-containing member inside the second diaphragm tank is in contact with one surface of the second diaphragm and the plating solution is in contact with the other surface of the second diaphragm during use. 
     
     
         4 . A method for manufacturing a zinc-based plating member, in which
 a first diaphragm tank which has a first diaphragm composed of a cation exchange membrane and accommodates a first electrolytic solution is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and an acidic plating solution accommodated inside a plating tank is in contact with the other surface of the first diaphragm,   a member to be plated that is in contact with the plating solution in the plating tank is cathode-electrolyzed,   a soluble zinc-containing member that is in contact with the first electrolytic solution inside the first diaphragm tank is anode-electrolyzed, and a soluble metal-containing member containing nickel which is an alloy element is anode-electrolyzed,   and thereby zinc-nickel plating is formed on the member to be plated while an increase in the zinc concentration of the plating solution is suppressed.   
     
     
         5 . The method for manufacturing a zinc-based plating member according to  claim 4 , wherein the soluble metal-containing member is in contact with the plating solution in the plating tank. 
     
     
         6 . The method for manufacturing a zinc-based plating member according to  claim 4 , wherein a second diaphragm tank which has a second diaphragm composed of a cation exchange membrane and accommodates a second electrolytic solution is arranged in a manner that the second electrolytic solution is in contact with one surface of the second diaphragm and the plating solution is in contact with the other surface of the second diaphragm, and
 the soluble metal-containing member is in contact with the second electrolytic solution in the second diaphragm tank is anode-electrolyzed.   
     
     
         7 . The method for suppressing an increase in the zinc concentration of a plating solution according to  claim 2 , further comprising a second diaphragm tank which is capable of accommodating a second electrolytic solution and has a second diaphragm composed of a cation exchange membrane, wherein the second diaphragm tank is arranged in a manner that the second electrolytic solution which is in contact with the soluble metal-containing member inside the second diaphragm tank is in contact with one surface of the second diaphragm and the plating solution is in contact with the other surface of the second diaphragm during use. 
     
     
         8 . The method for manufacturing a zinc-based plating member according to  claim 5 , wherein a second diaphragm tank which has a second diaphragm composed of a cation exchange membrane and accommodates a second electrolytic solution is arranged in a manner that the second electrolytic solution is in contact with one surface of the second diaphragm and the plating solution is in contact with the other surface of the second diaphragm, and
 the soluble metal-containing member is in contact with the second electrolytic solution in the second diaphragm tank is anode-electrolyzed.