US2022302363A1PendingUtilityA1

Light emitting device package and light source device

Assignee: SUZHOU LEKIN SEMICONDUCTOR CO LTDPriority: Sep 1, 2017Filed: May 16, 2022Published: Sep 22, 2022
Est. expirySep 1, 2037(~11.1 yrs left)· nominal 20-yr term from priority
H10W 90/00F21K 9/00H01L 33/62H01L 33/486H01L 33/56H01L 2933/0033H01L 33/60H10H 20/036H10H 20/8506H10H 20/856H10H 20/854H10H 20/857
65
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Claims

Abstract

A light emitting device package including first and second frames spaced apart from each other; a body disposed between the first and second frames, the body including a cavity having a side surface; and a light emitting device disposed in the cavity. Further, the side surface of the cavity includes a first side portion spaced from the light emitting device and disposed around the light emitting device, a groove portion disposed around the first side portion, and a second side portion disposed around the groove portion.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A light emitting device package comprising:
 first and second frames spaced apart from each other;   a body disposed between the first and second frames and including a cavity having a side surface; and   a light emitting device disposed in the cavity,   wherein the side surface of the cavity includes a first side portion spaced from the light emitting device and disposed around the light emitting device, a groove portion disposed around the first side portion, and a second side portion disposed around the groove portion.   
     
     
         2 . The light emitting device package of  claim 1 , wherein a bottom surface of the groove portion includes a first region in which a portion of the first frame is exposed. 
     
     
         3 . The light emitting device package of  claim 2 , wherein a protection device is disposed in the first region. 
     
     
         4 . The light emitting device package of  claim 1 , wherein
 the light emitting device includes a first bonding portion and a second bonding portion disposed on the first and second frames,   the first frame includes a first flat portion facing the first bonding portion and a first upper recess around the first flat portion, and   the second frame includes a second flat portion facing the second bonding portion and a second upper recess around the second flat portion.   
     
     
         5 . The light emitting device package of  claim 4 , wherein an upper surface area of the first flat portion or an upper surface area of the second flat portion is 20% to 45% of an area of a lower surface of the light emitting device. 
     
     
         6 . The light emitting device package of  claim 4 , wherein
 the first side portion includes a bottom portion extending in an outward direction of the light emitting device on the first and second upper recesses, and   a first resin is disposed on the bottom portion of the first side portion.   
     
     
         7 . The light emitting device package of  claim 4 , wherein
 the first side portion is continuously connected along the first and second upper recesses,   the groove portion comprises a second resin having a reflective material, and   the second resin is continuously connected to an outer periphery of the first side portion.   
     
     
         8 . The light emitting device package of  claim 4 , wherein
 the first frame includes a second region facing a side surface of the first region,   the first and second regions are disposed at both sides of the first upper recess,   the second frame includes third and fourth regions disposed on both sides of the second upper recess and facing each other,   a protection device disposed on the first region is connected to the third region by a wire, and   the first region and the third region are corresponded to each other.   
     
     
         9 . The light emitting device package of  claim 4 , wherein a thickness of a region disposed between the first and second upper recesses is thinner than a thickness of a region disposed between the first and second flat portions. 
     
     
         10 . The light emitting device package of  claim 1 , wherein the first side portion is inclined at a first inclination and the second side portion is inclined at a second inclination different than the first inclination. 
     
     
         11 . The light emitting device package of  claim 10 , wherein an angle of the first inclination is greater than an angle of the second inclination. 
     
     
         12 . The light emitting device package of  claim 1 , wherein the first side portion includes a stepped portion protruding underneath the light emitting device. 
     
     
         13 . The light emitting device package of  claim 12 , wherein a bottom of the stepped portion is disposed lower than a lower surface of the light emitting device. 
     
     
         14 . The light emitting device package of  claim 1 , wherein
 the first side portion is disposed along a lower periphery of the light emitting device, and   an upper surface of the first side portion is disposed as an inclined surface on a lower outer side of the light emitting device.   
     
     
         15 . The light emitting device package of  claim 1 , wherein
 a height of the first side portion extends above a lower surface of the light emitting device, and   the first side portion has an inclination inclining with respect to a side surface of the light emitting device to reflect light from the side surface of the light emitting device upwards and out of the cavity.   
     
     
         16 . The light emitting device package of  claim 1 , wherein a distance from the light emitting device to the first side portion gradually increases as a height of the first side portion increases. 
     
     
         17 . The light emitting device package of  claim 7 , wherein a height of an upper surface of the second resin is higher than a height of an upper surface of the first side portion. 
     
     
         18 . The light emitting device package of  claim 4 , wherein
 the body includes a recess or a through hole, and   a first resin is disposed in the recess or the through hole.   
     
     
         19 . The light emitting device package of  claim 18 , wherein the first resin is in contact with the light emitting device and side surfaces of the first and second bonding portions. 
     
     
         20 . The light emitting device package of  claim 4 , wherein
 a depth of the first upper recess is 40% to 60% of a thickness of the first flat portion, and   a depth of the second upper recess is 40% to 60% of a thickness of the second flat portion.

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