Conductive particle interconnect switch
Abstract
Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A method comprising:
determining a target state of a conductive particle interconnect (CPI); generating an input signal based on the target state; and transmitting the input signal to a voltage source to cause an electroactive polymer (EAP) disposed around the CPI to apply a force on the CPI, the force causing the CPI to transition to the target state.
2 . The method of claim 1 , the method further comprising:
determining a target voltage associated with the target state, wherein the target voltage is a voltage that causes the EAP to move to a position associated with the target state; and applying, by the voltage source, the target voltage to the EAP.
3 . The method of claim 1 , the method further comprising:
monitoring, after transmitting the input signal to the voltage source, an output of the CPI; and determining, based on the monitoring, whether the CPI is in the target state.
4 . The method of claim 3 , wherein monitoring the output of the CPI includes determining a resistance of the CPI, the method further comprising:
adjusting, in response to determining that the CPI is not in the target state, a voltage applied to the EAP, wherein the adjusting includes:
in response to the resistance of the CPI being too high, increasing the voltage applied to the EAP to cause further compression of the CPI; and
in response to the resistance of the CPI being too low, decreasing the voltage applied to the EAP to reduce compression of the CPI.
5 . The method of claim 3 , wherein monitoring the output of the CPI includes determining a resistance of the CPI, the method further comprising:
adjusting, in response to determining that the CPI is not in the target state, a voltage applied to the EAP, wherein the adjusting includes:
in response to the resistance of the CPI being too high, decreasing the voltage applied to the EAP to cause further compression of the CPI; and
in response to the resistance of the CPI being too low, increasing the voltage applied to the EAP to reduce compression of the CPI.
6 . The method of claim 1 , wherein:
the CPI is configured to act as a switch having two or more states, each of the two or more states having an associated position of the EAP; and transmitting the input signal to the voltage source causes the EAP to move into a position associated with the target state.
7 . The method of claim 1 , wherein the CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein.
8 . The method of claim 1 , wherein:
the EAP is configured to move between a first position and a second position in response to an electrical field; and the CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and to exhibit a second electrical resistance when the EAP is in the second position.
9 . The method of claim 1 , the method further comprising:
detecting that a temperature of the EAP is below a threshold; applying, in response to detecting that the temperature of the EAP is below the threshold, a DC bias voltage to the EAP, the DC bias voltage being a voltage that causes expansion of the EAP so as to offset constriction caused by the temperature.
10 . A system comprising:
a conductive particle interconnect (CPI); an electroactive polymer (EAP) disposed around the CPI; a voltage source coupled to the EAP; and processing logic configured to perform a method comprising:
determining a target state of the CPI;
generating an input signal based on the target state; and
transmitting the input signal to the voltage source to cause the EAP to apply a force on the CPI, the force causing the CPI to transition to the target state.
11 . The system of claim 10 , wherein:
the CPI is configured to act as a switch having two or more states, each of the two or more states having an associated position of the EAP; and transmitting the input signal to the voltage source causes the EAP to move into a position associated with the target state.
12 . The system of claim 10 , wherein:
the EAP is configured to move between at least a first position and a second position in response to an electrical field; and the CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and to exhibit a second electrical resistance when the EAP is in the second position.
13 . The system of claim 10 , the system further comprising a temperature sensor configured to measure a temperature of the EAP, wherein the method further comprises:
applying, in response to detecting that the temperature of the EAP is below a threshold, using the voltage source, a DC bias voltage to the EAP, the DC bias voltage being a voltage that causes expansion of the EAP so as to offset constriction caused by the temperature.
14 . The system of claim 10 , wherein the CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein.
15 . The system of claim 10 , wherein the method further comprises:
monitoring, after transmitting the input signal to the voltage source, an output of the CPI; and determining, based on the monitoring, whether the CPI is in the target state.
16 . A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by processor to cause the processor to perform a method comprising:
determining a target state of a conductive particle interconnect (CPI); generating an input signal based on the target state; and transmitting the input signal to a voltage source to cause an electroactive polymer (EAP) disposed around the CPI to apply a force on the CPI, causing the CPI to transition to the target state.
17 . The computer program product of claim 16 , wherein the method further comprises:
determining a target voltage associated with the target state, wherein the target voltage is a voltage that causes the EAP to move to a first position associated with the target state; and applying, by the voltage source, the target voltage to the EAP.
18 . The computer program product of claim 16 , wherein the method further comprises:
monitoring, after transmitting the input signal to the voltage source, an output of the CPI; and determining, based on the monitoring, whether the CPI is in the target state.
19 . The computer program product of claim 18 , wherein monitoring the output of the CPI includes determining a resistance of the CPI, the method further comprising:
adjusting, in response to determining that the CPI is not in the target state, a voltage applied to the EAP, wherein the adjusting includes:
in response to the resistance of the CPI being too high, increasing the voltage applied to the EAP to cause further compression of the CPI; and
in response to the resistance of the CPI being too low, decreasing the voltage applied to the EAP to reduce compression of the CPI.
20 . The computer program product of claim 16 , wherein:
the CPI is configured to act as a switch having two or more states, each of the two or more states having an associated position of the EAP; and transmitting the input signal to the voltage source causes the EAP to move into a position associated with the target state.Join the waitlist — get patent alerts
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