Electronic device

Abstract

The present disclosure provides an electronic device including a first metal layer, a first insulating layer, a second insulating layer, a second metal layer and a first transparent electrode. The first insulating layer is disposed on the first metal layer. The second insulating layer is disposed on the first insulating layer. The second metal layer is disposed between the first metal layer and the second insulating layer. A first via hole penetrates through the first insulating layer and the second insulating layer and exposes a portion of the first metal layer. A second via hole penetrates through the second insulating layer and exposes a portion of the second metal layer. The first transparent electrode is disposed on the second insulating layer and electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a substrate comprising an active region and a peripheral region adjacent to the active region;   a first metal layer disposed on the substrate;   a first insulating layer disposed on the first metal layer and comprising a first via hole in the peripheral region;   a second insulating layer disposed on the first insulating layer and comprising a second via hole in the peripheral region;   a second metal layer disposed between the first metal layer and the second insulating layer;   a third via hole penetrating through the second insulating layer and exposing a portion of the second metal layer in the peripheral region;   a fourth via hole penetrating through the first insulating layer and the second insulating layer and exposing a portion of the first metal layer in the peripheral region; and   a first transparent electrode disposed on the second insulating layer, wherein the first transparent electrode is electrically connected to the first metal layer through the fourth via hole and electrically connected to the second metal layer through the third via hole.   
     
     
         2 . The electronic device according to  claim 1 , wherein the first via hole is disposed within the second via hole, and the second via hole exposes a portion of a top surface of the first insulating layer in a top view direction of the electronic device. 
     
     
         3 . The electronic device according to  claim 1 , wherein the first transparent electrode directly contacts the first metal layer and the second metal layer. 
     
     
         4 . The electronic device according to  claim 1 , wherein a thickness of the first transparent electrode is less than a thickness of the first metal layer. 
     
     
         5 . The electronic device according to  claim 1 , wherein a thickness of the first transparent electrode is less than a thickness of the second metal layer. 
     
     
         6 . The electronic device according to  claim 1 , wherein in a top view of the electronic device, a length of the first metal layer is different from a length of the second metal layer. 
     
     
         7 . The electronic device according to  claim 6 , wherein in the top view of the electronic device, the length of the first metal layer is greater than the length of the second metal layer. 
     
     
         8 . The electronic device according to  claim 1 , wherein the first transparent electrode comprises a first portion, a second portion and a third portion, wherein the first portion is disposed within the third via hole, the second portion is disposed within the fourth via hole, and the third portion is disposed on a portion of a top surface of the second insulating layer. 
     
     
         9 . The electronic device according to  claim 1 , wherein in a top view of the electronic device, a length of the first transparent electrode is different from a length of the second metal layer. 
     
     
         10 . The electronic device according to  claim 9 , wherein in the top view of the electronic device, the length of the first transparent electrode is greater than the length of the second metal layer. 
     
     
         11 . The electronic device according to  claim 1 , wherein a diameter of the second via hole is greater than a diameter of the first via hole. 
     
     
         12 . An electronic device, comprising:
 a substrate comprising an active region and a peripheral region adjacent to the active region;   a first metal layer disposed on the substrate;   a first insulating layer disposed on the first metal layer;   a second insulating layer disposed on the first insulating layer;   a second metal layer disposed between the first metal layer and the second insulating layer;   a first via hole penetrating through the first insulating layer and the second insulating layer and exposing a portion of the first metal layer in the peripheral region;   a second via hole penetrating through the second insulating layer and exposing a portion of the second metal layer in the peripheral region; and   a first transparent electrode disposed on the second insulating layer, wherein the first transparent electrode is electrically connected to the first metal layer through the first via hole and electrically connected to the second metal layer through the second via hole.