Nitride-based semiconductor module and method for manufacturing the same

Abstract

The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

1 . A printed circuit board suitable for implementation of a semiconductor device, comprising
 an upper surface;   a lower surface opposite to the upper surface;   one or more substrate layers arranged between the upper surface and the lower surface;   a cavity having one or more interior sidewalls being substantially perpendicular to the upper and lower surfaces; and   a plurality of interior conductive leads fixed on and extending from the upper surface of the printed circuit board and bending into the cavity;   wherein the cavity of the printed circuit board has a shape conformal to a shape of an enclosure of the semiconductor device such that the semiconductor device can be removably press-fitted into the cavity of the printed circuit board; and   wherein the plurality of interior conductive leads in the cavity of the printed circuit board are configured to be resiliently contactable to and electrically couplable with a plurality of exterior conductive contacts of the semiconductor device such that the cavity act as an electrical socket cooperating with an electrical plug acted by the semiconductor device.   
     
     
         2 . The printed circuit board according to  claim 1 , wherein each of the interior conductive leads comprises:
 a first lead portion fixed on a conductive pad on the upper surface and extending from the conductive pad to an edge of the cavity;   a second lead portion bending from the first lead portion and extending substantially longitudinally downward along one of the interior sidewalls into the cavity.   
     
     
         3 . The printed circuit board according to  claim 2 , wherein the second lead portion is elastically deformable to have a resilient contact with the exterior conductive contacts of the semiconductor device when the semiconductor device is inserted into the cavity. 
     
     
         4 . The printed circuit board according to  claim 3 , wherein the second lead portion is pushed by the semiconductor device and having a movable end flushing against the interior sidewall in the cavity such that the second lead portion is deformed to have a substantially flat surface coupling with the exterior conductive contacts of the semiconductor device when the semiconductor device is inserted into the cavity 
     
     
         5 . The printed circuit board according to  claim 1 , wherein the cavity has a through-hole structure. 
     
     
         6 . The printed circuit board according to  claim 1 , wherein the cavity has a blind-hole structure. 
     
     
         7 . A semiconductor module, comprising:
 a printed circuit board, comprising:
 an upper surface; 
 a lower surface opposite to the upper surface; 
 one or more substrate layers arranged between the upper and lower surfaces; 
 a cavity having one or more interior sidewalls being substantially perpendicular to the upper and lower surfaces; 
 a plurality of interior conductive leads fixed on and extending from the upper surface of the printed circuit board and bending into the cavity; 
   a semiconductor device having an enclosure and a plurality of exterior conductive contacts exposed on a plurality of side surfaces of the enclosure;   wherein the cavity of the printed circuit board and the enclosure of the semiconductor device have shapes conformal to each other such that the semiconductor device can be removably press-fitted into the cavity of the printed circuit board; and   wherein the plurality of exterior conductive contacts of the semiconductor are configured to be contactable to and electrically couplable with the plurality of interior conductive leads in the cavity of the printed circuit board such that the semiconductor device act as an electrical plug cooperating with the cavity which act as an electrical socket.   
     
     
         8 . The semiconductor module according to  claim 7 , wherein the cavity of the printed circuit board has a through-hole structure. 
     
     
         9 . The semiconductor module according to  claim 8 , further comprising a first heatsink mounted on a top surface of the semiconductor device and a second heatsink mounted on a bottom surface of the semiconductor device. 
     
     
         10 . The semiconductor module according to  claim 7 , wherein the cavity of the printed circuit board has a blind-hole structure. 
     
     
         11 . The semiconductor module according to  claim 10 , further comprising a first heatsink mounted on a top surface of the semiconductor device. 
     
     
         12 . A method for manufacturing a printed circuit board suitable for implementation of a semiconductor device, comprising:
 providing a printed circuit board patterned with conductive traces and pads on an upper surface and a bottom surface;   forming a cavity in the printed circuit board; and   placing and fixing a plurality of interior conductive leads respectively to a plurality of conductive pads near the cavity and on the upper surface of the printed circuit board such that each of the conductive leads has a first lead portion substantially laterally extending from the conductive pads to an edge of the cavity; and a second lead portion bending from the first lead portion and extending substantially longitudinally downward along an interior sidewall into the cavity;   wherein the cavity of the printed circuit board has a shape conformal to a shape of an enclosure of the semiconductor device such that the semiconductor device can be removably press-fitted into the cavity of the printed circuit board; and   wherein the plurality of interior conductive leads are configured to be resiliently contactable to and electrically couplable with a plurality of exterior conductive contacts of the semiconductor device such that the cavity act as an electrical socket cooperating with an electrical plug acted by the semiconductor device.