Transdermal microneedle array patch

Abstract

Provided is a transdermal microneedle array patch, including: a bottom cover; a top cover; a substrate disposed within the top cover; and a first probe and a second probe disposed between the bottom cover and the top cover and electrically connected the substrate. The first and second probes form an open circuit. While the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.

1 - 16 . (canceled) 
     
     
         17 . A transdermal microneedle array patch, comprising:
 a bottom cover;   a top cover;   a substrate disposed within the top cover and including a dielectric layer and a circuit layer formed on the dielectric layer, wherein an open circuit is formed in the circuit layer is in open circuit; and   a first probe and a second probe disposed between the top cover and the bottom cover,   wherein when the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes are in contact with the circuit layer to enable the circuit layer to form a closed circuit.   
     
     
         18 . The transdermal microneedle array patch of  claim 17 , wherein the bottom cover includes a first surface and a second surface opposite to the first surface, and a metal sheet is provided on the first surface of the bottom cover and comes into contact with the first and second probes when the bottom cover is combined with the top cover to form the transdermal microneedle array patch, such that the circuit layer forms the closed circuit. 
     
     
         19 . The transdermal microneedle array patch of  claim 18 , wherein both of the first and second probes are disposed on the circuit layer of the substrate or on the metal sheet of the bottom cover, or one of the first and second probes is disposed on the circuit layer of the substrate while the other is disposed on the metal sheet of the bottom cover. 
     
     
         20 . The transdermal microneedle array patch of  claim 17 , wherein when the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes are forced to come into contact with each other to form the closed circuit under pressure from the bottom cover.