High-temperature ultrasonic sensor

Abstract

A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-temperature portion such that the low-temperature portion is subjected to significantly less heat from the structure compared to the high-temperature portion.

What is claimed is: 
     
         1 . A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, said sensor comprising:
 a high-temperature portion for ultrasonically coupling with said structure, said high-temperature portion comprising at least:
 at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; 
 a low-temperature portion comprising at least: 
 at least one digital sensor interface (DSI) to which said transducer is electrically connected, said DSI being configured to transmit said first electrical signal and receive said second electrical signal, and to generate an A-scan signal based on said first and second electrical signals; 
 a communication interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and 
 a battery for powering said DSI and said wireless interface; and 
   an elongated member connecting said high temperature portion and said low temperature portion, said elongated member being sufficient rigid and long to hold said low-temperature portion a sufficient distance away from said high-temperature portion such that said low-temperature portion is subjected to significantly less heat from said structure compared to said high-temperature portion.   
     
     
         2 - 24 . (canceled)