Acoustic lens and applications thereof

Abstract

An ultrasound apparatus includes an ultrasound transducer array configured to transmit and receive ultrasound signals and an acoustic lens that includes signal-attenuating particles in a polymer matrix configured to provide signal attenuation and impedance matching for the ultrasound signals. The acoustic lens is disposed over a first surface of the ultrasound transducer array. The signal-attenuating particles include PEBAX.

What is claimed is: 
     
         1 . An ultrasound apparatus, comprising:
 an ultrasound transducer array configured to transmit and receive ultrasound signals; and   an acoustic lens comprising a plurality of signal-attenuating particles in a polymer matrix configured to provide signal attenuation and impedance matching for the ultrasound signals, the acoustic lens disposed over a first surface of the ultrasound transducer array,
 wherein the signal-attenuating particles comprise PEBAX. 
   
     
     
         2 . The ultrasound apparatus of  claim 1 , further comprising:
 a heat sink positioned over a second surface of the transducer array.   
     
     
         3 . The ultrasound apparatus of  claim 2 , further comprising a tungsten-epoxy layer interposed between the heatsink and an inner layer of the acoustic lens to attenuate transducer vibration. 
     
     
         4 . The ultrasound apparatus of  claim 3 , wherein the tungsten-epoxy layer is integrated into the heat sink. 
     
     
         5 . The ultrasound apparatus of  claim 2 , wherein the heat sink further comprises a plurality of tabs. 
     
     
         6 . The ultrasound apparatus of  claim 1 , further comprising:
 a circuit board in communication with the ultrasound transducer array to process the ultrasound signals.   
     
     
         7 . The ultrasound apparatus of  claim 6 , wherein the circuit board processes the ultrasound signals received by the transducer array by converting them to digital signals. 
     
     
         8 . The ultrasound apparatus of  claim 6 , wherein the circuit board processes the ultrasound signals by converting a digital signal into an ultrasound signal prior to transmission of the ultrasound signal. 
     
     
         9 . The ultrasound apparatus of  claim 1 , wherein the polymer matrix comprises a room-temperature vulcanized (RTV) polymer. 
     
     
         10 . The ultrasound apparatus of  claim 1 , wherein the polymer matrix further comprises one or more of Al 2 O 3  or graphite. 
     
     
         11 . The ultrasound apparatus of  claim 1 , wherein a surface of the acoustic lens is configured to receive an ultrasound gel pad. 
     
     
         12 . An ultrasound probe, comprising:
 an ultrasound transducer array comprising one or more ultrasound transducers emitting an acoustic signal;   an acoustic lens focusing the acoustic signal; and   an acoustic layer between the acoustic lens and the ultrasound transducer array,
 wherein the acoustic layer has a speed of sound that is different from a speed of sound in the acoustic lens. 
   
     
     
         13 . The ultrasound probe of  claim 12 ,
 wherein the acoustic coupling layer has a thickness in a range of 10-100 micrometers (um).   
     
     
         14 . The ultrasound probe of  claim 12 ,
 wherein the one or more ultrasound transducers are at least one selected from a group consisting of a capacitive micromachined ultrasonic transducer (CMUT) and a piezoelectric micromachined ultrasonic transducer (PMUT).   
     
     
         15 . The ultrasound probe of  claim 12 ,
 wherein the acoustic lens is mechanically flexible.   
     
     
         16 . The ultrasound probe of  claim 12 ,
 wherein the acoustic lens is configured to provide signal attenuation and impedance matching.   
     
     
         17 . The ultrasound probe of  claim 12 , wherein:
 the acoustic lens comprises an outer layer; and   the outer layer comprises a room-temperature vulcanized (RTV) polymer.   
     
     
         18 . The ultrasound probe of  claim 12 , further comprising a heat sink disposed on the ultrasound transducer array. 
     
     
         19 . The ultrasound probe of  claim 18 , wherein the heat sink comprises a plurality of tabs. 
     
     
         20 . The ultrasound probe of  claim 19 , further comprising a circuit board disposed between the plurality of tabs.