Cooling device

Abstract

The present invention provides a cooling device, comprising a first cooling portion, a second cooling portion, and a first receiving cavity sandwiched between the first cooling portion and the second cooling portion, where the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are distributed spaced-apart. According to the present invention, the liquid to be cooled in the first receiving cavity is simultaneously cooled by the first cooling portion and the second cooling portion without an additive being added, so that the cooling effect is substantially improved.

1 . A cooling device, wherein the cooling device comprises a first cooling portion, a second cooling portion, and a first receiving cavity sandwiched between the first cooling portion and the second cooling portion, where the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are distributed spaced-apart. 
     
     
         2 . The cooling device according to  claim 1 , wherein the cooling device comprises a cup body, the cup body comprises an outer wall and a first inner wall in sequence from the outside to the inside, the first cooling portion is formed between the outer wall and the first inner wall, the second cooling portion is located in a cavity surrounded by the first inner wall, and the first receiving cavity is formed between the first inner wall and the second cooling portion. 
     
     
         3 . The cooling device according to  claim 2 , wherein the cooling device further comprises a lid that fits with the cup body. 
     
     
         4 . The cooling device according to  claim 2 , wherein the outer wall comprises an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, the first inner wall comprises a first bottom wall and a first peripheral wall disposed around the first bottom wall, a first gap is disposed between the outer bottom wall and the first bottom wall, a second gap is disposed between the outer peripheral wall and the first peripheral wall, and the first gap is communicated with the second gap. 
     
     
         5 . The cooling device according to  claim 4 , wherein a gap exists between an outer surface of the second cooling portion and the first bottom wall and between the outer surface of the second cooling portion and the first peripheral wall. 
     
     
         6 . The cooling device according to  claim 2 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion. 
     
     
         7 . The cooling device according to  claim 6 , wherein the cooling device further comprises a lid fitted with the cup body, and the semiconductor cooling portion is connected to the lid. 
     
     
         8 . The cooling device according to  claim 2 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit. 
     
     
         9 . The cooling device according to  claim 8 , wherein the cup body further comprises a second inner wall, the second inner wall is far away from the outer wall relative to the first inner wall, the first receiving cavity is formed between the first inner wall and the second inner wall, and the second inner wall surrounds to form the second refrigerant circuit. 
     
     
         10 . The cooling device according to  claim 9 , wherein the cup body further comprises a third inner wall, the third inner wall is far away from the outer wall relative to the second inner wall, the second refrigerant circuit is formed between the second inner wall and the third inner wall, the third inner wall surrounds to form a second receiving cavity, and the second receiving cavity is communicated with the first receiving cavity. 
     
     
         11 . The cooling device according to  claim 3 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion. 
     
     
         12 . The cooling device according to  claim 4 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion. 
     
     
         13 . The cooling device according to  claim 5 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion. 
     
     
         14 . The cooling device according to  claim 3 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit. 
     
     
         15 . The cooling device according to  claim 4 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit. 
     
     
         16 . The cooling device according to  claim 5 , wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.