US2023003812A1PendingUtilityA1

Overhead power line sensor

Assignee: SENTIENT TECH HOLDINGS LLCPriority: Nov 18, 2016Filed: Sep 9, 2022Published: Jan 5, 2023
Est. expiryNov 18, 2036(~10.3 yrs left)· nominal 20-yr term from priority
G01R 31/58G01R 31/085H04B 3/46G01R 19/2513G01R 15/142
74
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Claims

Abstract

A power distribution monitoring system is provided that can include a number of features. The system can include a plurality of power line sensing devices configured to attach to individual conductors on a power grid distribution network. The sensing devices can be configured to measure and monitor, among other things, current values and waveforms, phase voltage, conductor current, phase-to-phase voltage, conductor temperatures, ambient temperatures, vibration, wind speed and monitoring device system diagnostics. The sensing devices can include an equipotential surface configured to reduce incumbent E-field disturbance of the conductor. The sensing devices can include a monitor-device conductor shell sized and shaped to position the equipotential surface at a distance with respect to the conductor regardless of diameter of the conductor. Methods of installing and protecting the system are also discussed.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A monitoring device, comprising:
 a connector for coupling the monitor device to a conductor of a power distribution network;   electronics coupled to the connector that, during operation of the monitoring device, obtain sensed data associated with the conductor; and   a housing that houses the connector, the housing including at least one equipotential surface that is configured to reduce incumbent E-field disturbance of the conductor during operation of the monitoring device.   
     
     
         2 . The monitoring device of  claim 1 , the connector including a clamp. 
     
     
         3 . The monitoring device of  claim 1 , the electronics being configured to monitor at least one of: phase voltage, current, phase-to-phase voltage, conductor temperature, ambient temperature, vibration, windspeed, or system diagnostics. 
     
     
         4 . The monitoring device of  claim 1 , the electronics including at least one of: a current sensor, voltage sensor, phase sensor, data acquisition circuitry, power transformer, a wireless communication system, power supply, energy harvesting components, a microprocessor board and CPU, or a GPS receiver. 
     
     
         5 . The monitoring device of  claim 1 , further comprising power harvesting electronics configured to harvest energy from the conductor or another conductor to provide power to the monitoring device. 
     
     
         6 . The monitoring device of  claim 1 , further comprising an overmold covering the housing and configured to protect the monitoring device from moisture. 
     
     
         7 . The monitoring device of  claim 6 , the overmold being silicon. 
     
     
         8 . The monitoring device of  claim 1 , the equipotential surface comprising a conductive object having a potential designed to match an incumbent equipotential surface of the conductor. 
     
     
         9 . The monitoring device of  claim 1 , the equipotential surface comprising a plurality of equipotential surfaces. 
     
     
         10 . The monitoring device of  claim 1 , the equipotential surface being semicircular. 
     
     
         11 . The monitoring device of  claim 1 , further comprising an insulator that encapsulates the equipotential surface. 
     
     
         12 . The monitoring device of  claim 11 , the insulator further encapsulating at least a portion of a wire coupled to the monitoring device. 
     
     
         13 . The monitoring device of  claim 11 , the insulator being silicon. 
     
     
         14 . A monitor device component, comprising:
 a monitor-device conductor shell that is positionable to encircle a minimum and maximum conductor shell of a conductor of a power line distribution system; and   an equipotential surface positioned with respect to the monitor-device conductor shell;   wherein the monitor-device conductor shell is sized and shaped to position the equipotential surface at a distance with respect to the conductor regardless of diameter of the conductor.   
     
     
         15 . The monitor device component of  claim 14 , wherein the monitor-device conductor shell comprises a clam shell structure configured to be closed over the conductor. 
     
     
         16 . The monitor device component of  claim 14 , wherein the monitor-device conductor shell comprises a semicircular shape with an opening greater than a maximum diameter of the conductor. 
     
     
         17 . The monitor device component of  claim 14 , the distance correlating to a 1 kV potential between the equipotential surface and a system local ground of the monitor device. 
     
     
         18 . The monitor device component of  claim 17 , the system local ground being conductor potential of the conductor. 
     
     
         19 . The monitor device component of  claim 14 , further comprising an insulator that encapsulates the equipotential surface. 
     
     
         20 . The monitor device component of  claim 14 , the equipotential surface coupled with a voltage divider.

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