Method for producing an electrically conductive structure

Abstract

A method produces a composite from a conductive structure, a carrier made of non-conductive carrier material made from thermosetting plastic, and at least one electronic component by laser radiation. The non-conductive carrier material having an additive, which is configured to subsequently form a catalytically active species in an electroless metallization bath by irradiation with the laser radiation. The method includes: forming the conductive structure being by irradiation using pulsed laser radiation having a pulse duration of less than 100 picoseconds and subsequent electroless metallization. A pulse repetition rate is set such that consecutive pulses of the pulsed laser radiation in an area of the additive to be activated or an additive area are diverted mutually overlapping onto the additive or the additive area.

1 . A method for producing a composite from at least one conductive structure, a carrier made of non-conductive carrier material made from thermosetting plastic, and at least one electronic component by laser radiation, the non-conductive carrier material comprising an additive, which is configured to subsequently form a catalytically active species in an electroless metallization bath by irradiation with the laser radiation, the method comprising:
 forming the conductive structure being by irradiation using pulsed laser radiation having a pulse duration of less than 100 picoseconds and subsequent electroless metallization, a pulse repetition rate being set such that consecutive pulses of the pulsed laser radiation in an area of the additive to be activated or an additive area are diverted mutually overlapping onto the additive or the additive area.   
     
     
         2 . The method of  claim 1 , wherein the laser radiation is imaged through a part-transmissive mask onto the carrier. 
     
     
         3 . The method of  claim 1 , wherein a polygon scanner is used for positioning the laser radiation on the carrier. 
     
     
         4 . The method of  claim 1 , wherein a plurality of galvanometer scanners are used for positioning the laser radiation on the carrier. 
     
     
         5 . The method of  claim 1 , wherein a resonant mirror is used for positioning the laser radiation on the carrier. 
     
     
         6 . The method of  claim 1 , wherein by using a non-contacting measuring method, an actual position and/or an actual orientation of the electronic component in the non-conductive carrier material and subsequently a deviation from the actual position and/or the actual orientation from the desired position and/or desired orientation is determined,. and correction values are derived therefrom for the subsequent irradiation of the non-conductive carrier material by the pulsed laser radiation, and irradiation is carried out taking into account the correction values. 
     
     
         7 . The method of  claim 1 , wherein four galvanometer scanners are used for positioning the laser radiation on the carrier. 
     
     
         8 . The method of  claim 6 , wherein by using the non-contacting measuring method comprises using X-rays.