Tile apparatus with selectively collapsible non-adhesive support system and method of use

Abstract

A tile apparatus for installation on a substrate having a contact adhesive array affixed to the underside of the tile body, the contact adhesive array comprising at least one adhesive feature extending from the underside and defining an array height relative to the underside, and a support system affixed to the underside of the tile body offset from the contact adhesive array, the support system comprising at least one non-adhesive standoff positioned adjacent to the at least one adhesive feature and extending from the underside and defining a standoff height relative to the underside that is greater than the array height, the at least one non-adhesive standoff of the support system supporting the tile body and being selectively slidable relative to the substrate upon application of a lateral force to the tile body and selectively collapsible upon application of a collapsing force to the tile body toward the substrate.

1 . A tile apparatus for installation on a substrate, the apparatus comprising:
 a tile body having a top side and an opposite underside, the tile body being rigid and selected from the group consisting of ceramic, porcelain, stone, wood, laminate, and synthetic material;   a contact adhesive array affixed to the underside of the tile body, the contact adhesive array comprising at least one adhesive feature extending from the underside and defining an array height relative to the underside as the perpendicular distance from the underside of the tile body to an apex of the at least one adhesive feature; and   a support system configured to be affixed to the underside of the tile body offset from the contact adhesive array in a secondary operation after production of the tile body with the contact adhesive array, the support system comprising at least one non-adhesive standoff configured to be positioned adjacent to the at least one adhesive feature and to extend from the underside and having a standoff contact surface and defining a standoff height relative to the underside as the perpendicular distance from the underside of the tile body to the standoff contact surface of the at least one non-adhesive standoff that is greater than the array height, the at least one non-adhesive standoff of the support system configured to support the tile body and be selectively slidable relative to the substrate upon installation of the at least one non-adhesive standoff on the underside of the tile body, positioning of the tile body adjacent to the substrate with the standoff contact surface of the at least one non-adhesive standoff in contact with the substrate, and application of a lateral force to the tile body, and the at least one non-adhesive standoff then being selectively collapsible upon application of a collapsing force to the top side of the tile body toward the substrate,   whereby the support system in a first operational mode of the apparatus supports the tile body and slidably spaces the contact adhesive array from the substrate on which the apparatus is to be installed for ease of positioning and repositioning of the tile body relative to the substrate upon application of the lateral force, wherein in the first operational mode the standoff height is approximately three to five millimeters (3-5 mm) and the array height is approximately two to three millimeters (2-3 mm) such that the standoff height is at least approximately one to two millimeters (1-2 mm) greater than the array height, and   further whereby the support system in a second operational mode of the apparatus allows the contact adhesive array to contact the substrate based on the application of the collapsing force to the top side of the tile body so as to selectively collapse the at least one non-adhesive standoff and thereby install the tile body on the substrate via the contact adhesive array, wherein in the second operational mode both the standoff height and the array height are approximately one to two millimeters (1-2 mm).   
     
     
         2 . (canceled) 
     
     
         3 . (canceled) 
     
     
         4 . (canceled) 
     
     
         5 . (canceled) 
     
     
         6 . (canceled) 
     
     
         7 . The apparatus of  claim 1  wherein the at least one adhesive feature of the contact adhesive array comprises offset lengthwise beads and offset widthwise beads at opposite ends of the lengthwise beads. 
     
     
         8 . The apparatus of  claim 7  wherein:
 the tile body comprises opposite lengthwise edges and opposite widthwise edges so as to define a tile body perimeter; and 
 the widthwise beads and outermost lengthwise beads together form a perimeter portion of the contact adhesive array that substantially corresponds to the tile body perimeter, the outermost lengthwise beads corresponding to the respective lengthwise edges of the tile body and the widthwise beads corresponding to the respective widthwise edges of the tile body. 
 
     
     
         9 . The apparatus of  claim 8  wherein additional lengthwise beads span between opposite widthwise beads in forming the contact adhesive array. 
     
     
         10 . The apparatus of  claim 1  wherein the contact adhesive array and any adhesive feature thereof may be any one or a combination of a pressure sensitive adhesive (PSA) selected from the group consisting of hot melt PSA, asphalt-based PSA, and acrylate-based PSA. 
     
     
         11 . The apparatus of  claim 1  wherein the standoff contact surface is substantially non-adhesive. 
     
     
         12 . The apparatus of  claim 11  wherein the standoff contact surface is reduced-friction to facilitate relative movement between the standoff contact surface and the substrate. 
     
     
         13 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is formed as a column. 
     
     
         14 . The apparatus of  claim 13  wherein a plurality of non-adhesive standoffs formed as columns are configured to be placed at corners of the underside of the tile body. 
     
     
         15 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is formed as a rail. 
     
     
         16 . The apparatus of  claim 15  wherein a plurality of non-adhesive standoffs formed as rails are configured to be placed lengthwise along the underside of the tile body. 
     
     
         17 . The apparatus of  claim 16  wherein:
 the at least one adhesive feature of the contact adhesive array comprises offset lengthwise beads and offset widthwise beads at opposite ends of the lengthwise beads; and 
 each non-adhesive standoff is configured to be positioned on the underside of the tile body between adjacent lengthwise beads. 
 
     
     
         18 . The apparatus of  claim 17  wherein a non-adhesive standoff is configured to be positioned between each pair of adjacent lengthwise beads, whereby the underside of the tile body is substantially covered. 
     
     
         19 . The apparatus of  claim 1  wherein in the second operational mode of the apparatus the collapsed at least one non-adhesive standoff becomes a part of the permanent installation of the tile body and thus adds to the overall insulative characteristics of the installed apparatus. 
     
     
         20 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is porous. 
     
     
         21 . (canceled) 
     
     
         22 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is selected from the group consisting of polychloroprene (neoprene), ethylene propylene diene monomer (EPDM), thermoplastic elastomer (TPE), and thermoplastic olefin (TPO). 
     
     
         23 . (canceled) 
     
     
         24 . (canceled) 
     
     
         25 . (canceled) 
     
     
         26 . (canceled) 
     
     
         27 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is formed as a pre-cut, self-adhesive member. 
     
     
         28 . (canceled) 
     
     
         29 . The apparatus of  claim 1  wherein the at least one non-adhesive standoff is treated with an antimicrobial or antibacterial agent. 
     
     
         30 . (canceled) 
     
     
         31 . A method of employing the tile apparatus of  claim 1 , the method comprising the steps of:
 installing the at least one non-adhesive standoff on the underside of the tile body to form the support system in a secondary operation after production of the apparatus comprising the tile body and the contact adhesive array;   placing the apparatus on a substrate with the underside of the tile body facing the substrate such that the standoff contact surface of the at least one non-adhesive standoff is in contact with the substrate and the at least one non-adhesive standoff of the support system spaces the at least one adhesive feature of the contact adhesive array from the substrate;   repositioning the apparatus on the substrate as needed by laterally shifting the tile body relative to the substrate as enabled by the support system; and   pushing the tile body toward the substrate to collapse the at least one non-adhesive standoff of the support system and allow the at least one adhesive feature of the contact adhesive array to contact the substrate and thereby install the tile body on the substrate via the contact adhesive array.   
     
     
         32 . The method of  claim 31  wherein the step of repositioning the apparatus comprises at least one of sliding or rotating the tile body. 
     
     
         33 . (canceled) 
     
     
         34 . (canceled) 
     
     
         35 . (canceled) 
     
     
         36 . (canceled) 
     
     
         37 . (canceled) 
     
     
         38 . (canceled) 
     
     
         39 . (canceled)